Category:Masashi HAYASHIGUCHI

Masashi HAYASHIGUCHI

Executive Summary

Masashi HAYASHIGUCHI is an inventor who has filed 7 patents. Their primary areas of innovation include the devices being of types provided for in two or more different subgroups of the same main group of groups (3 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (3 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (2 patents), and they have worked with companies such as ROHM CO., LTD. (7 patents). Their most frequent collaborators include (2 collaborations), (1 collaborations), (1 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

• H01L25/18 (the devices being of types provided for in two or more different subgroups of the same main group of groups): 3 patents
• H01L2924/13055 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L25/07 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L23/36 (Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks {(): 2 patents
• H01L23/488 (consisting of soldered {or bonded} constructions {(bump connectors): 2 patents
• H01L24/06 ({of a plurality of bonding areas}): 2 patents
• H01L24/49 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H02M7/48 (APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF (transformers): 2 patents
• H01L2224/0603 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/4903 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/49175 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/49431 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/49433 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L23/49562 (Lead-frames {or other flat leads (): 2 patents
• H01L24/40 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L24/48 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L23/645 ({Inductive arrangements (): 1 patents
• H01L24/32 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/73 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/32227 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/32238 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/40229 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/48229 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/73263 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/13091 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/12032 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H03K17/127 (Modifications for increasing the maximum permissible switched current): 1 patents
• H03K17/122 (Modifications for increasing the maximum permissible switched current): 1 patents
• H02M1/08 (Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters): 1 patents
• H02M7/537 (using devices of a triode or transistor type requiring continuous application of a control signal {(): 1 patents
• H01L23/49541 (Lead-frames {or other flat leads (): 1 patents
• H02M7/003 (Conversion of ac power input into dc power output; Conversion of dc power input into ac power output): 1 patents
• H01L23/49575 (Lead-frames {or other flat leads (): 1 patents
• H01L23/3107 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/49506 ({an insulative substrate being used as a diepad, e.g. ceramic, plastic (): 1 patents
• H01L23/4952 (Lead-frames {or other flat leads (): 1 patents
• H01L23/49568 (Lead-frames {or other flat leads (): 1 patents
• H01L23/49589 (Lead-frames {or other flat leads (): 1 patents
• H01L23/50 (for integrated circuit devices, {e.g. power bus, number of leads} (): 1 patents
• H05K1/144 (Structural association of two or more printed circuits (providing electric connection to or between printed circuits): 1 patents
• H01L23/49811 ({Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads (): 1 patents
• H01L25/115 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H05K1/18 (Printed circuits structurally associated with non-printed electric components ({): 1 patents
• H01L23/40 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/37 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/45 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/37011 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/37147 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/40137 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/40225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/45124 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/45144 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/45147 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/48225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01R12/718 ({Contact members provided on the PCB without an insulating housing (contacts for abutting): 1 patents
• H05K2201/10166 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H05K2201/10871 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents

Companies

List of Companies

• ROHM CO., LTD.: 7 patents

Collaborators

• Kenji HAYASHI (2 collaborations)
• Kenichi ONODERA (1 collaborations)
• Takumi KANDA (1 collaborations)