Category:Koichi FUKAYA

Koichi FUKAYA

Executive Summary

Koichi FUKAYA is an inventor who has filed 3 patents. Their primary areas of innovation include Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se (2 patents), CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL (brushes (1 patents), CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL (brushes (1 patents), and they have worked with companies such as EBARA CORPORATION (3 patents). Their most frequent collaborators include (2 collaborations), (2 collaborations), (1 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

• H01L21/67046 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 2 patents
• B08B1/04 (CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL (brushes): 1 patents
• B08B1/02 (CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL (brushes): 1 patents
• B08B3/041 ({Cleaning travelling work}): 1 patents
• B08B1/40 (CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL (brushes): 1 patents
• B08B1/36 (CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL (brushes): 1 patents
• H01L21/67051 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 1 patents
• B08B1/32 (using rotary cleaning members): 1 patents
• B08B3/024 ({Cleaning by means of spray elements moving over the surface to be cleaned}): 1 patents
• B24B7/228 ({for grinding thin, brittle parts, e.g. semiconductors, wafers (grinding edges of thin, brittle parts): 1 patents
• H01L21/6719 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 1 patents
• H01L21/67219 ({comprising at least one polishing chamber (polishing apparatuses): 1 patents
• H01L21/67253 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 1 patents
• H01L21/68764 (using mechanical means, e.g. chucks, clamps or pinches {(using elecrostatic chucks): 1 patents

Companies

List of Companies

• EBARA CORPORATION: 3 patents

Collaborators

• Fumitoshi OIKAWA (2 collaborations)
• Mitsuru MIYAZAKI (2 collaborations)
• Yosuke HIMORI (1 collaborations)
• Tomoaki FUJIMOTO (1 collaborations)
• Takuya INOUE (1 collaborations)