Category:Ker-Yih Kao

Ker-Yih Kao

Executive Summary

Ker-Yih Kao is an inventor who has filed 7 patents. Their primary areas of innovation include {Multilayer substrates (multilayer metallisation on monolayer substrate (2 patents), Protection against electrostatic charges or discharges, e.g. Faraday shields (2 patents), Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate (1 patents), and they have worked with companies such as Innolux Corporation (5 patents), InnoLux Corporation (2 patents). Their most frequent collaborators include (3 collaborations), (2 collaborations), (2 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

• H01L23/49822 ({Multilayer substrates (multilayer metallisation on monolayer substrate): 2 patents
• H01L23/60 (Protection against electrostatic charges or discharges, e.g. Faraday shields): 2 patents
• H01L23/49838 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 1 patents
• H01L21/4857 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
• H01L21/486 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
• H01L24/16 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/32 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/73 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/92 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/16238 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/32225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/73204 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/92125 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H05K1/0296 ({Conductive pattern lay-out details not covered by sub groups): 1 patents
• H05K3/28 (Applying non-metallic protective coatings {(): 1 patents
• H05K2201/09063 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H01L27/124 (the substrate being other than a semiconductor body, e.g. an insulating body): 1 patents
• H01L25/167 (the devices being of types provided for in two or more different main groups of groups): 1 patents
• H01L27/0292 ({using a specific configuration of the conducting means connecting the protective devices, e.g. ESD buses}): 1 patents
• H01L23/562 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/3128 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/08 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/78603 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/08225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L27/0248 ({for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection}): 1 patents
• H05K1/0259 ({Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance (): 1 patents
• H01L24/05 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05552 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/30205 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H05K2201/10128 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• G01R31/2607 (Testing of individual semiconductor devices (testing or measuring during manufacture or treatment {): 1 patents
• G01N21/84 (Systems specially adapted for particular applications): 1 patents

Companies

List of Companies

• Innolux Corporation: 5 patents
• InnoLux Corporation: 2 patents

Collaborators

• Ming-Chun Tseng (3 collaborations)
• Kuang-Ming Fan (2 collaborations)
• Jui-Jen Yueh (2 collaborations)
• Ju-Li Wang (2 collaborations)
• Chin-Ming Huang (1 collaborations)
• Heng-Shen Yeh (1 collaborations)
• Chia-Lin Yang (1 collaborations)
• Chi-Lun Kao (1 collaborations)
• Kung-Chen Kuo (1 collaborations)
• Cheng-Chi Wang (1 collaborations)
• Yen-Fu Liu (1 collaborations)
• Tong-Jung Wang (1 collaborations)
• Wen-Chieh Lin (1 collaborations)
• Yi-Hung Lin (1 collaborations)
• Mu-Fan Chang (1 collaborations)
• Yi-Hua Hsu (1 collaborations)
• Hung-Sheng Liao (1 collaborations)
• Min-Hsin Lo (1 collaborations)
• Wang-Chih Tsai (1 collaborations)
• Chien-Li Lin (1 collaborations)