Category:Kenji MIYATA

Kenji MIYATA

Executive Summary

Kenji MIYATA is an inventor who has filed 6 patents. Their primary areas of innovation include Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives (3 patents), obtained by SEM (3 patents), Thermal properties (3 patents), and they have worked with companies such as DENKA COMPANY LIMITED (4 patents), Denka Company Limited (2 patents). Their most frequent collaborators include (5 collaborations), (2 collaborations), (2 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

• C08K2003/385 (Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives): 3 patents
• C01P2004/03 (obtained by SEM): 3 patents
• C01P2006/32 (Thermal properties): 3 patents
• C08K2201/004 (Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives): 2 patents
• C01B21/064 (Binary compounds of nitrogen with metals, with silicon, or with boron, {or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron} (azides): 2 patents
• C08K3/38 (Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives): 2 patents
• C01P2004/54 (Particles characterised by their aspect ratio, i.e. the ratio of sizes in the longest to the shortest dimension): 2 patents
• C01P2004/61 (INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS): 2 patents
• C01P2006/12 (Surface area): 2 patents
• C01P2006/16 (INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS): 2 patents
• C01P2006/21 (Attrition-index or crushing strength of granulates): 2 patents
• C09K5/14 (MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE): 2 patents
• C08K2201/001 (Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives): 2 patents
• C08K7/24 (Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives): 1 patents
• C08J5/18 (Manufacture of films or sheets): 1 patents
• C08K2201/003 (Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives): 1 patents
• C08K2201/006 (Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives): 1 patents
• C01B21/0646 ({Preparation by pyrolysis of boron and nitrogen containing compounds}): 1 patents
• C01P2004/50 (Agglomerated particles): 1 patents
• C08K2201/005 (Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives): 1 patents
• H05K1/0306 (Use of materials for the substrate): 1 patents
• H05K3/4644 (Manufacturing multilayer circuits): 1 patents
• C04B37/001 ({directly with other burned ceramic articles}): 1 patents
• C04B37/021 ({in a direct manner, e.g. direct copper bonding [DCB]}): 1 patents
• H05K2201/0175 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H05K2203/085 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• C04B2237/361 (Boron nitride): 1 patents
• C04B2237/68 (Forming laminates or joining articles wherein at least one substrate contains at least two different parts of macro-size, e.g. one ceramic substrate layer containing an embedded conductor or electrode): 1 patents
• C01B21/0648 ({After-treatment, e.g. grinding, purification (transformation of hexagonal into cubic or wurtzitic boron nitride): 1 patents
• C08K7/00 (Use of ingredients characterised by shape): 1 patents
• C08J3/203 (WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES): 1 patents
• C01P2002/72 (by d-values or two theta-values, e.g. as X-ray diagram): 1 patents

Companies

List of Companies

• DENKA COMPANY LIMITED: 4 patents
• Denka Company Limited: 2 patents

Collaborators

• Yusuke SASAKI (5 collaborations)
• Michiharu NAKASHIMA (2 collaborations)
• Kei KUBOBUCHI (2 collaborations)
• Takako ARAI (2 collaborations)
• Tomonari MIYAZAKI (2 collaborations)
• Shohji IWAKIRI (1 collaborations)
• Saori INOUE (1 collaborations)