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Category:Hiroki Tanaka of Gilbert AZ (US)
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Pages in category "Hiroki Tanaka of Gilbert AZ (US)"
The following 35 pages are in this category, out of 35 total.
1
- 17847434. PACKAGING ARCHITECTURE WITH COAXIAL PILLARS FOR HIGH-SPEED INTERCONNECTS simplified abstract (Intel Corporation)
- 17932624. MICROELECTRONIC ASSEMBLIES WITH MIXED COPPER AND SOLDER INTERCONNECTS HAVING DIFFERENT THICKNESSES simplified abstract (Intel Corporation)
- 17943915. COPPER CLAD LAMINATE (CCL) FOR PLATING PADS WITHIN A GLASS CAVITY FOR GLASS CORE APPLICATIONS simplified abstract (Intel Corporation)
- 17949857. IC PACKAGE WITH LEDS simplified abstract (Intel Corporation)
- 17957341. DIRECTLY COUPLED OPTICAL INTERPOSER simplified abstract (Intel Corporation)
- 17957600. HYBRID PLASMONIC WAVEGUIDE AND METHOD FOR HIGH DENSITY PACKAGING INTEGRATED WITH A GLASS INTERPOSER simplified abstract (Intel Corporation)
- 17957751. HYBRID BONDING TECHNOLOGIES WITH THERMAL EXPANSION COMPENSATION STRUCTURES simplified abstract (Intel Corporation)
- 17957783. MULTICHIP IC DEVICES IN GLASS MEDIUM & INCLUDING AN INTERCONNECT BRIDGE DIE simplified abstract (Intel Corporation)
- 17958002. MICROELECTRONICS PACKAGES WITH PHOTO-INTEGRATED GLASS INTERPOSER simplified abstract (Intel Corporation)
- 18046635. PACKAGE ARCHITECTURE WITH GLASS CORE SUBSTRATE HAVING INTEGRATED INDUCTORS simplified abstract (Intel Corporation)
- 18047033. PACKAGE SUBSTRATE WITH DUAL DAMASCENE BASED SELF-ALIGNED VIAS simplified abstract (Intel Corporation)
- 18055605. PACKAGE ARCHITECTURE WITH MICROFLUIDIC CHANNELS IN GLASS SUBSTRATES simplified abstract (Intel Corporation)
- 18059057. PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES simplified abstract (Intel Corporation)
- 18060125. INTEGRATED CIRCUIT PACKAGES INCLUDING A GLASS CORE WITH A FILTER STRUCTURE simplified abstract (Intel Corporation)
- 18065250. APPARATUS AND METHOD FOR ELECTROLESS SURFACE FINISHING ON GLASS simplified abstract (Intel Corporation)
- 18090260. ELECTRO-OPTICAL CIRCUITS WITH MODULAR SWITCHABLE PHOTONIC INTERFACE simplified abstract (Intel Corporation)
- 18147535. METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO PRODUCE INTEGRATED CIRCUIT PACKAGES HAVING SILICON NITRIDE ADHESION PROMOTERS simplified abstract (Intel Corporation)
I
- Intel corporation (20240105575). ELECTROLYTIC SURFACE FINISH ARCHITECTURE simplified abstract
- Intel corporation (20240105576). DFR OVERHANG PROCESS FLOW FOR ELECTROLYTIC SURFACE FINISH FOR GLASS CORE simplified abstract
- Intel corporation (20240105580). SURFACE FINISH WITH METAL DOME simplified abstract
- Intel corporation (20240111090). DIRECTLY COUPLED OPTICAL INTERPOSER simplified abstract
- Intel corporation (20240111095). HYBRID PLASMONIC WAVEGUIDE AND METHOD FOR HIGH DENSITY PACKAGING INTEGRATED WITH A GLASS INTERPOSER simplified abstract
- Intel corporation (20240112972). MICROELECTRONICS PACKAGES WITH PHOTO-INTEGRATED GLASS INTERPOSER simplified abstract
- Intel corporation (20240113005). HYBRID BONDING TECHNOLOGIES WITH THERMAL EXPANSION COMPENSATION STRUCTURES simplified abstract
- Intel corporation (20240113029). MULTICHIP IC DEVICES IN GLASS MEDIUM & INCLUDING AN INTERCONNECT BRIDGE DIE simplified abstract
- Intel corporation (20240128181). PACKAGE SUBSTRATE WITH DUAL DAMASCENE BASED SELF-ALIGNED VIAS simplified abstract
- Intel corporation (20240128247). PACKAGE ARCHITECTURE WITH GLASS CORE SUBSTRATE HAVING INTEGRATED INDUCTORS simplified abstract
- Intel corporation (20240162158). PACKAGE ARCHITECTURE WITH MICROFLUIDIC CHANNELS IN GLASS SUBSTRATES simplified abstract
- Intel corporation (20240176070). PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES simplified abstract
- Intel corporation (20240178162). INTEGRATED CIRCUIT PACKAGES INCLUDING A GLASS CORE WITH A FILTER STRUCTURE simplified abstract
- Intel corporation (20240186250). Microelectronic Assembly Including Interconnect Bridges with Through Vias Embedded Therein simplified abstract
- Intel corporation (20240186270). MICROELECTRONIC ASSEMBLY HAVING ANTIFERROMAGNETIC FILM STRUCTURE THEREIN simplified abstract
- Intel corporation (20240194548). APPARATUS AND METHOD FOR ELECTROLESS SURFACE FINISHING ON GLASS simplified abstract
- Intel corporation (20240219644). ELECTRO-OPTICAL CIRCUITS WITH MODULAR SWITCHABLE PHOTONIC INTERFACE simplified abstract
- Intel corporation (20240222259). METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO PRODUCE INTEGRATED CIRCUIT PACKAGES HAVING SILICON NITRIDE ADHESION PROMOTERS simplified abstract