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Category:H05K1/16
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Pages in category "H05K1/16"
The following 21 pages are in this category, out of 21 total.
1
- 17745238. ANTENNA STRUCTURE SUPPORTING WIRELESS CHARGING AND ELECTRONIC DEVICE HAVING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18067557. DEVICE HAVING AN IN-SUBSTRATE INDUCTOR AND METHOD FOR MAKING THE INDUCTOR simplified abstract (QUALCOMM Incorporated)
- 18093947. PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE COMPRISING COUPLER simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18120761. EMBOSSED INDUCTOR DESIGN FOR MOTHERBOARD VOLTAGE REGULATORS TO INCREASE OVERALL SYSTEM POWER DENSITY simplified abstract (Intel Corporation)
- 18148598. STACKED INORGANIC-ORGANIC DIELECTRICS FOR THIN FILM CAPACITORS IN PACKAGE SUBSTRATES simplified abstract (Intel Corporation)
- 18173767. ISOLATOR simplified abstract (KABUSHIKI KAISHA TOSHIBA)
- 18353384. BATTERY AND ELECTRONIC DEVICE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18417033. CIRCUIT, CIRCUIT BOARD, AND HEAT SINK ASSEMBLY FOR RETROFITTING A LIGHTING SYSTEM WITH LED LIGHTS simplified abstract (Musco Corporation)
- 18490449. SUBSTRATE COMPRISING AN INDUCTIVE COUPLER FOR SIGNAL LEAKAGE REDUCTION simplified abstract (QUALCOMM Incorporated)
- 18542381. PACKAGED INTEGRATED CIRCUIT HAVING PACKAGE SUBSTRATE WITH INTEGRATED ISOLATION CIRCUIT simplified abstract (Texas Instruments Incorporated)
D
I
- Intel corporation (20240222295). STACKED INORGANIC-ORGANIC DIELECTRICS FOR THIN FILM CAPACITORS IN PACKAGE SUBSTRATES simplified abstract
- Intel corporation (20240312690). EMBOSSED INDUCTOR DESIGN FOR MOTHERBOARD VOLTAGE REGULATORS TO INCREASE OVERALL SYSTEM POWER DENSITY simplified abstract
- Intel Corporation patent applications on July 4th, 2024
- Intel Corporation patent applications on September 19th, 2024