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Category:H01L23/473
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Pages in category "H01L23/473"
The following 49 pages are in this category, out of 49 total.
1
- 17455949. DOUBLE PATTERNED MICROCOOLER HAVING ALTERNATING FIN WIDTHS simplified abstract (International Business Machines Corporation)
- 17808221. ELECTROMAGNETIC WAVEGUIDING THROUGH LIQUID COOLING CONDUIT simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17809128. Cooling Cover and Packaged Semiconductor Device Including the Same simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17826505. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17877041. 3D High Bandwidth Memory and Optical Connectivity Stacking simplified abstract (GOOGLE LLC)
- 17932765. ELECTROMAGNETIC SHIELD OF AN INTEGRATED CIRCUIT PACKAGE simplified abstract (HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP)
- 17957403. HIGH PERFORMANCE PERMANENT GLASS ARCHITECTURES FOR STACKED INTEGRATED CIRCUIT DEVICES simplified abstract (Intel Corporation)
- 17961371. SEMICONDUCTOR PACKAGE AND COOLING SYSTEM simplified abstract (Samsung Electronics Co., Ltd.)
- 18034133. TECHNOLOGIES FOR ISOLATED HEAT DISSIPATING DEVICES simplified abstract (Intel Corporation)
- 18133276. POWER DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18149793. Integrated Circuit Packages and Methods of Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18403763. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18418434. HEAT DISSIPATION APPARATUS, DEVICE, RACK, AND SYSTEM simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)
- 18435741. TEMPERATURE CONTROL FOR MULTIPLE DIE TYPES IN A COMMON PACKAGE simplified abstract (Cisco Technology, Inc.)
- 18437385. THERMAL INTERFACE MATERIAL, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18453026. CHIP PROTECTION DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18514763. COOLING SYSTEM FOR A SEMICONDUCTOR DEVICE ASSEMBLY simplified abstract (Micron Technology, Inc.)
2
- 20240014101. MICROFLUIDIC CHANNELS SEALED WITH DIRECTIONALLY-GROWN PLUGS simplified abstract (GlobalFoundries U.S. Inc.)
- 20240038633. EMBEDDED COOLING SYSTEMS AND METHODS OF MANUFACTURING EMBEDDED COOLING SYSTEMS simplified abstract (Invensas Bonding Technologies, Inc.)
- 20240047304. JET IMPINGEMENT COOLING WITH BYPASS FLUID PORTION FOR HIGH POWER SEMICONDUCTOR DEVICES simplified abstract (SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC)
B
- Blockchain patent applications on 22nd Mar 2024
- Blockchain patent applications on April 11th, 2024
- Blockchain patent applications on February 1st, 2024
- Blockchain patent applications on February 22nd, 2024
- Blockchain patent applications on February 8th, 2024
- Blockchain patent applications on January 11th, 2024
- Blockchain patent applications on March 21st, 2024
D
H
I
- Intel corporation (20240105582). LOW TEMPERATURE CAPACITIVELY COUPLED DEVICE FOR LOW NOISE CIRCUITS simplified abstract
- Intel corporation (20240113087). HIGH PERFORMANCE PERMANENT GLASS ARCHITECTURES FOR STACKED INTEGRATED CIRCUIT DEVICES simplified abstract
- Intel Corporation patent applications on April 4th, 2024
- Intel Corporation patent applications on January 25th, 2024
- Intel Corporation patent applications on March 28th, 2024
M
S
- Samsung electronics co., ltd. (20240096748). CHIP PROTECTION DEVICE simplified abstract
- Samsung electronics co., ltd. (20240096944). POWER DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240186215). THERMAL INTERFACE MATERIAL, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME simplified abstract
- SAMSUNG ELECTRONICS CO., LTD. patent applications on June 6th, 2024
- Samsung Electronics Co., Ltd. patent applications on June 6th, 2024
- Samsung Electronics Co., Ltd. patent applications on March 21st, 2024
T
- Taiwan semiconductor manufacturing company, ltd. (20240136251). SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on April 25th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on March 14th, 2024