Category:Daisuke IKEDA

Daisuke IKEDA

Executive Summary

Daisuke IKEDA is an inventor who has filed 5 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (5 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (4 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (2 patents), and they have worked with companies such as Resonac Corporation (5 patents). Their most frequent collaborators include (5 collaborations), (5 collaborations), (4 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

• H01L21/561 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 5 patents
• H01L21/568 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
• H01L2224/97 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L24/97 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L24/19 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L24/96 ({the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting}): 2 patents
• H01L2224/19 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/96 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L23/3135 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L23/3128 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/95001 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L21/6836 ({Wafer tapes, e.g. grinding or dicing support tapes (adhesive tapes in general): 1 patents
• H01L21/60 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2221/68363 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2221/68327 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2021/6006 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/78 (with subsequent division of the substrate into plural individual devices (cutting to change the surface-physical characteristics or shape of semiconductor bodies): 1 patents
• H01L24/20 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/95 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/295 ({containing a filler (): 1 patents
• H01L21/6835 ({using temporarily an auxiliary support}): 1 patents
• H01L2224/214 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2221/68359 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2221/68377 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/16 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/16225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/15165 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/15311 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

List of Companies

• Resonac Corporation: 5 patents

Collaborators

• Shogo SOBUE (5 collaborations)
• Saeko OGAWA (5 collaborations)
• Keisuke OKAWARA (4 collaborations)
• Hiroaki MATSUBARA (3 collaborations)
• Yuki NAKAMURA (1 collaborations)