Category:Cheng-Chi WANG

Cheng-Chi WANG

Executive Summary

Cheng-Chi WANG is an inventor who has filed 9 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (4 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (3 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (3 patents), and they have worked with companies such as InnoLux Corporation (9 patents). Their most frequent collaborators include (3 collaborations), (2 collaborations), (2 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

• H01L24/16 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
• H01L24/13 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L2224/16227 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L23/49838 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 3 patents
• H01L23/3128 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/13082 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/13105 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/13111 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/13124 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/13139 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/13144 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/13147 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L23/49816 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 2 patents
• H01L24/32 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L24/73 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/32225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H05K3/4038 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 2 patents
• H01L24/11 ({Manufacturing methods (for bumps on insulating substrates): 2 patents
• G01J1/0437 (Optical or mechanical part {supplementary adjustable parts}): 1 patents
• G01J1/0411 (Optical or mechanical part {supplementary adjustable parts}): 1 patents
• H01L24/81 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/13155 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/81385 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/16225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/73204 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/15311 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L25/0753 (the devices being of a type provided for in group): 1 patents
• H01L33/54 (having a particular shape): 1 patents
• H01L33/60 (Reflective elements): 1 patents
• H01L33/62 (Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls): 1 patents
• H01L2224/13166 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/12041 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2933/005 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2933/0066 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/49822 ({Multilayer substrates (multilayer metallisation on monolayer substrate): 1 patents
• H01L2924/15174 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H05K1/115 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H05K1/0271 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H05K1/0274 ({Optical details, e.g. printed circuits comprising integral optical means (): 1 patents
• H05K2201/096 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H05K2201/09827 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H01L22/20 ({Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps}): 1 patents
• H01L21/561 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/568 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/19 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/117 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/11901 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/1011 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/486 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
• H01L23/49827 ({Via connections through the substrates, e.g. pins going through the substrate, coaxial cables (): 1 patents
• C23C14/34 (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion): 1 patents
• C23C14/5873 (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion): 1 patents
• C23C28/023 (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion): 1 patents
• C23C28/322 (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion): 1 patents
• C25D7/123 ({Semiconductors first coated with a seed layer or a conductive layer}): 1 patents
• H01L2224/11462 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/13005 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/13021 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/16237 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/73203 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/6835 ({using temporarily an auxiliary support}): 1 patents
• H05K1/113 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H05K3/4673 (Manufacturing multilayer circuits): 1 patents
• H05K2201/0266 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents

Companies

List of Companies

• InnoLux Corporation: 9 patents

Collaborators

• Jui-Jen YUEH (3 collaborations)
• Ju-Li WANG (2 collaborations)
• Chin-Ming HUANG (2 collaborations)
• Te-Hsun LIN (2 collaborations)
• Wen-Hsiang LIAO (2 collaborations)
• Ming-Hsien SHIH (2 collaborations)
• Yung-Feng CHEN (2 collaborations)
• Kuan-Feng LEE (2 collaborations)
• Yu-Chia HUANG (1 collaborations)
• Nai-Fang HSU (1 collaborations)
• Kuan-Hsueh LIN (1 collaborations)
• Jia-Yuan CHEN (1 collaborations)
• Mei-Yen CHEN (1 collaborations)
• Tzu-Yen CHIU (1 collaborations)
• Chin-Lung TING (1 collaborations)
• Yu-Jen CHANG (1 collaborations)
• Chien-Feng LI (1 collaborations)
• Chia-Lin YANG (1 collaborations)