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Category:CPC H05K7/20272
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Pages in category "CPC H05K7/20272"
The following 53 pages are in this category, out of 53 total.
1
- 18151833. LIQUID-TIGHT STRUCTURE WITH A FASTENER COMPONENT simplified abstract (Dell Products L.P.)
- 18295929. RECTIFIER DIODE ASSEMBLY simplified abstract (Hamilton Sundstrand Corporation)
- 18300755. ISOLATING TEMPERATURE FLUCTUATION IN AN ELECTRONICS ENCLOSURE simplified abstract (International Business Machines Corporation)
- 18402083. ELECTRICAL DEVICE AND CASE simplified abstract (DENSO CORPORATION)
- 18524763. ELECTRONIC DEVICE AND POWER CONVERSION DEVICE simplified abstract (Honda Motor Co., Ltd.)
- 18591258. COOLING METHOD, ELECTRONIC DEVICE MANUFACTURING METHOD, AND COOLING DEVICE simplified abstract (Kioxia Corporation)
- 18731522. PACKAGING STRUCTURE simplified abstract (Huawei Digital Power Technologies Co., Ltd.)
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- Dell products l.p. (20240237278). SYSTEM AND METHOD FOR THERMAL MANAGEMENT USING LIQUID COOLING simplified abstract
- Dell products l.p. (20240237279). COOLING AND SHOCK ISOLATION ARCHITECTURE FOR STANDALONE AND SCALABLE LIQUID COOLING MODULES simplified abstract
- Dell products l.p. (20240237281). LIQUID-TIGHT STRUCTURE WITH A FASTENER COMPONENT simplified abstract
- Dell products l.p. (20240292565). MONITORING CLOSED LOOP LIQUID AIR ASSISTED COOLING MODULE PERFORMANCE IN REAL TIME simplified abstract
- Dell Products L.P. patent applications on August 29th, 2024
- Dell Products L.P. patent applications on July 11th, 2024
- Dell Products, L.P. Patent Application Trends in 2024
- DENSO CORPORATION Patent Application Trends in 2024
H
I
- Intel corporation (20240276675). METHODS AND APPARATUS TO MITIGATE HOTSPOTS IN INTEGRATED CIRCUIT PACKAGES USING GIMBALING NOZZLES AND JET VECTORING IMPINGEMENT simplified abstract
- Intel Corporation patent applications on August 15th, 2024
- International business machines corporation (20240349448). ISOLATING TEMPERATURE FLUCTUATION IN AN ELECTRONICS ENCLOSURE simplified abstract
- International Business Machines Corporation patent applications on October 17th, 2024
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- Micron Technology, Inc. Patent Application Trends in 2024
- Microsoft technology licensing, llc (20240206116). SYSTEMS AND METHODS FOR MICROFLUIDIC THERMAL MANAGEMENT simplified abstract
- Microsoft Technology Licensing, LLC Patent Application Trends in 2024
- Microsoft Technology Licensing, LLC patent applications on June 20th, 2024
- Mitsubishi Heavy Industries, Ltd. Patent Application Trends in 2024
