Category:Bungo TANAKA

Bungo TANAKA

Executive Summary

Bungo TANAKA is an inventor who has filed 10 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (4 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (4 patents), comprising only passive thin-film or thick-film elements formed on a common insulating substrate {(passive two-terminal components without a potential-jump or surface barrier for integrated circuits, details thereof and multistep manufacturing processes therefor (4 patents), and they have worked with companies such as ROHM CO., LTD. (9 patents), Rohm Co., Ltd. (1 patents). Their most frequent collaborators include (4 collaborations), (1 collaborations), (1 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

• H01L24/48 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
• H01L2224/45144 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
• H01L27/01 (comprising only passive thin-film or thick-film elements formed on a common insulating substrate {(passive two-terminal components without a potential-jump or surface barrier for integrated circuits, details thereof and multistep manufacturing processes therefor): 4 patents
• H01L24/05 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L2224/48091 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L24/32 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L24/73 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L24/29 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L2224/45124 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L2224/73265 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L23/49575 (Lead-frames {or other flat leads (): 3 patents
• H01L25/18 (the devices being of types provided for in two or more different subgroups of the same main group of groups): 3 patents
• H01L24/45 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L2224/48137 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L24/49 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/05554 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/05567 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/29139 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/2919 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/32245 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/45147 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/48106 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/49175 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2924/0665 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L28/10 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L24/13 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/3114 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/5226 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/49548 ({Cross section geometry (): 1 patents
• H01L23/5283 ({Geometry or} layout of the interconnection structure {(): 1 patents
• H01L23/49582 (Lead-frames {or other flat leads (): 1 patents
• H01L24/06 ({of a plurality of bonding areas}): 1 patents
• H01L24/03 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/01046 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/04042 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/13147 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/1357 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/13647 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/13018 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/13082 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/13166 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/13181 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/13184 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/1318 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/13176 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/13171 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05582 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05655 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05664 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/48227 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/01029 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/01022 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/04941 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/01073 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/01074 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/01042 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/01024 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/01044 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/01028 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/83 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/83801 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05147 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/48465 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/562 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/29101 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05012 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/181 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/53223 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/145 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/3192 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L27/016 ({Thin-film circuits}): 1 patents
• H01L23/3171 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L28/20 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/3107 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/4952 (Lead-frames {or other flat leads (): 1 patents
• H01L25/0655 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/10 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/3135 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/49513 (Lead-frames {or other flat leads (): 1 patents
• H01L23/49541 (Lead-frames {or other flat leads (): 1 patents
• H01L2224/48245 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/1424 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/14252 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01F27/40 (MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES (ceramics based on ferrites): 1 patents
• H01F27/324 (MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES (ceramics based on ferrites): 1 patents
• H01F27/29 (MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES (ceramics based on ferrites): 1 patents
• H01G4/228 (CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric): 1 patents
• H01F17/0013 (Fixed inductances of the signal type  {(coils in general): 1 patents

Companies

List of Companies

• ROHM CO., LTD.: 9 patents
• Rohm Co., Ltd.: 1 patents

Collaborators

• Keiji WADA (4 collaborations)
• Satoshi KAGEYAMA (1 collaborations)
• Yuta KASHITANI (1 collaborations)
• Toshiyuki KANAYA (1 collaborations)
• Genki MATSUYAMA (1 collaborations)
• Kazumasa NISHIO (1 collaborations)
• Kosei OSADA (1 collaborations)