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Category:Brandon Christian Marin of Gilbert AZ (US)
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Pages in category "Brandon Christian Marin of Gilbert AZ (US)"
The following 14 pages are in this category, out of 14 total.
1
- 17943354. TECHNOLOGIES FOR GLASS CORE INDUCTOR simplified abstract (Intel Corporation)
- 17958053. METHODS AND APPARATUSES FOR THROUGH-GLASS VIAS simplified abstract (Intel Corporation)
- 17988051. BUMPLESS HYBRID ORGANIC GLASS INTERPOSER simplified abstract (Intel Corporation)
- 18059923. PHOTONIC INTEGRATED CIRCUIT (PIC) FIRST PATCH ARCHITECTURE simplified abstract (Intel Corporation)
- 18065250. APPARATUS AND METHOD FOR ELECTROLESS SURFACE FINISHING ON GLASS simplified abstract (Intel Corporation)
I
- Intel corporation (20240112973). METHODS AND APPARATUSES FOR THROUGH-GLASS VIAS simplified abstract
- Intel corporation (20240162157). BUMPLESS HYBRID ORGANIC GLASS INTERPOSER simplified abstract
- Intel corporation (20240176084). PHOTONIC INTEGRATED CIRCUIT (PIC) FIRST PATCH ARCHITECTURE simplified abstract
- Intel corporation (20240186227). INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP LAYERS COMPRISING SPIN-ON GLASS (SOG) simplified abstract
- Intel corporation (20240186228). INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP LAYERS COMPRISING SPIN-ON GLASS (SOG) simplified abstract
- Intel corporation (20240186250). Microelectronic Assembly Including Interconnect Bridges with Through Vias Embedded Therein simplified abstract
- Intel corporation (20240186270). MICROELECTRONIC ASSEMBLY HAVING ANTIFERROMAGNETIC FILM STRUCTURE THEREIN simplified abstract
- Intel corporation (20240188212). PACKAGE SUBSTRATE ARCHITECTURES WITH IMPROVED COOLING simplified abstract
- Intel corporation (20240194548). APPARATUS AND METHOD FOR ELECTROLESS SURFACE FINISHING ON GLASS simplified abstract