Category:Adrianus Buijsman

Adrianus Buijsman

Executive Summary

Adrianus Buijsman is an inventor who has filed 4 patents. Their primary areas of innovation include Printed circuits structurally associated with non-printed electric components ({ (2 patents), PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS (1 patents), Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave (1 patents), and they have worked with companies such as NXP B.V. (4 patents). Their most frequent collaborators include (3 collaborations), (2 collaborations), (1 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

• H05K1/181 (Printed circuits structurally associated with non-printed electric components ({): 2 patents
• H05K1/113 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H01Q13/00 (Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave): 1 patents
• H05K1/119 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H05K3/0026 (Apparatus or processes for manufacturing printed circuits): 1 patents
• H05K3/0047 (Apparatus or processes for manufacturing printed circuits): 1 patents
• H01L23/49816 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 1 patents
• H05K2201/09036 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H05K2201/09072 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H05K2201/09509 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H05K2201/09518 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H05K2201/096 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H05K2201/09609 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H05K2203/107 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H01L23/66 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/4853 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
• H01L23/13 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/49838 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 1 patents
• H01P5/103 (for coupling balanced lines or devices with unbalanced lines or devices): 1 patents
• H01Q1/50 (Structural association of antennas with earthing switches, lead-in devices or lightning protectors): 1 patents
• H05K1/0243 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H05K1/115 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H01P5/085 ({Coaxial-line/strip-line transitions}): 1 patents
• H01Q1/22 (by structural association with other equipment or articles): 1 patents
• H05K1/111 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H01P3/121 ({integrated in a substrate}): 1 patents
• H01Q1/38 (formed by a conductive layer on an insulating support {(patch antennas): 1 patents
• H01Q1/2283 ({mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package}): 1 patents

Companies

List of Companies

• NXP B.V.: 4 patents

Collaborators

• Abdellatif Zanati (3 collaborations)
• Jonas Ove Harm (2 collaborations)
• Mark Steigemann (1 collaborations)
• Harshitha Thippur Shivamurthy (1 collaborations)
• Rabia Syeda (1 collaborations)
• Rocío Gabriela Molina Moreno (1 collaborations)
• Cristine Aguila Badiao (1 collaborations)
• Pieter Lok (1 collaborations)
• Leo van Gemert (1 collaborations)
• Maarten Lont (1 collaborations)
• Giorgio Carluccio (1 collaborations)
• Antonius Johannes Matheus de Graauw (1 collaborations)