Canon kabushiki kaisha (20240260167). ELECTRONIC MODULE, IMAGING UNIT AND EQUIPMENT simplified abstract
Contents
ELECTRONIC MODULE, IMAGING UNIT AND EQUIPMENT
Organization Name
Inventor(s)
MITSUTOSHI Hasegawa of Kanagawa (JP)
ELECTRONIC MODULE, IMAGING UNIT AND EQUIPMENT - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240260167 titled 'ELECTRONIC MODULE, IMAGING UNIT AND EQUIPMENT
The abstract describes a patent application for a printed wiring board that includes a first conductive layer with a second electrode group bonded to a flexible printed circuit board, a second conductive layer, and a plane with different regions of varying density.
- The printed wiring board has a first conductive layer with a second electrode group bonded to a flexible printed circuit board.
- It also includes a second conductive layer and a plane with different regions of varying density.
- The plane consists of a first region with a reference region set in a bonded portion, a second region via a first boundary, and a third region via a second boundary.
- The first and second boundary portions are positioned within specific ranges in relation to the length of the short side of the board.
- The density of the second conductive layer in the first region is higher than that in the second region.
Potential Applications: - This technology can be used in electronic devices such as smartphones, tablets, and laptops. - It can also be applied in automotive electronics and industrial control systems.
Problems Solved: - Provides a more efficient and reliable connection between the flexible printed circuit board and the printed wiring board. - Ensures consistent performance and durability in electronic devices.
Benefits: - Improved connectivity and signal transmission. - Enhanced overall performance and longevity of electronic devices.
Commercial Applications: - This technology can be utilized by electronics manufacturers to enhance the quality and reliability of their products. - It can also be integrated into various industries that rely on electronic components for their operations.
Questions about the technology: 1. How does the density of the second conductive layer impact the performance of the printed wiring board? 2. What are the specific advantages of bonding the second electrode group to the flexible printed circuit board in this design?
Original Abstract Submitted
a printed wiring board has a first conductive layer including a second electrode group bonded to a first electrode group of a flexible printed circuit board, and a second conductive layer, and a plane including the second conductive layer includes a first region including a reference region set in a bonded portion, a second region via a first boundary, and a third region via a second boundary, and a first boundary portion is positioned within a range of 0.5 times or more and 5 times or less a length of a short side of four sides in a prescribed direction, and a second boundary portion is positioned within a range of 0.5 times or more and 5 times or less the length of the short in a prescribed direction, and a density of the second conductive layer in the first region is higher than that in the second region.
