Canon kabushiki kaisha (20240243094). BONDING METHOD, BONDING APPARATUS, ARTICLE MANUFACTURING METHOD, DETERMINATION METHOD, INFORMATION PROCESSING APPARATUS, AND STORAGE MEDIUM simplified abstract
BONDING METHOD, BONDING APPARATUS, ARTICLE MANUFACTURING METHOD, DETERMINATION METHOD, INFORMATION PROCESSING APPARATUS, AND STORAGE MEDIUM
Organization Name
Inventor(s)
MASAHIRO Kimura of Tochigi (JP)
KENICHIRO Mori of Tochigi (JP)
BONDING METHOD, BONDING APPARATUS, ARTICLE MANUFACTURING METHOD, DETERMINATION METHOD, INFORMATION PROCESSING APPARATUS, AND STORAGE MEDIUM - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240243094 titled 'BONDING METHOD, BONDING APPARATUS, ARTICLE MANUFACTURING METHOD, DETERMINATION METHOD, INFORMATION PROCESSING APPARATUS, AND STORAGE MEDIUM
The present invention involves a bonding method for attaching multiple objects to a substrate by determining an offset amount to adjust the bonding position on the substrate for each object before bonding them.
- The method involves determining an offset amount to adjust the bonding position on the substrate for each object based on arrangement information representing the arrangement of other objects to be bonded later.
- After bonding the first set of objects to the substrate, a process of bonding a second set of objects to the first set is performed.
- The offset amount is calculated to meet a predetermined condition based on the arrangement information of the second set of objects on their substrate.
Potential Applications: - This method can be used in the manufacturing of electronic devices where precise bonding of components is crucial. - It can also be applied in the production of microelectronics and microfluidic devices.
Problems Solved: - Ensures accurate bonding of multiple objects to a substrate. - Facilitates the sequential bonding of different sets of objects in a controlled manner.
Benefits: - Improved precision in bonding processes. - Efficient utilization of space on substrates. - Streamlined manufacturing processes.
Commercial Applications: Title: Precision Bonding Method for Electronic Device Manufacturing This technology can be utilized in the production of smartphones, tablets, and other electronic devices where compact and precise component placement is essential. It can also find applications in the semiconductor industry for fabricating integrated circuits.
Questions about the Precision Bonding Method: 1. How does the offset amount calculation contribute to the overall efficiency of the bonding process? 2. What are the key factors to consider when determining the offset amount for bonding objects on a substrate?
Original Abstract Submitted
the present invention provides a bonding method of bonding each of a plurality of first objects to a first substrate, comprising: determining, as an offset amount, an amount to offset a bonding position on the first substrate from a design position for each of the plurality of first objects; and bonding each of the plurality of first objects to the first substrate based on the offset amount determined in the determining, wherein after the bonding, a process of bonding a plurality of second objects which are bonded to a second substrate, to the plurality of first objects bonded to the first substrate is performed, and wherein in the determining, the offset amount is determined to satisfy a predetermined condition based on arrangement information representing an arrangement of the plurality of second objects on the second substrate.
