CHIP PACKAGE AND CHIP PACKAGE PREPARATION METHOD: abstract simplified (18335332)

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  • This abstract for appeared for patent application number 18335332 Titled 'CHIP PACKAGE AND CHIP PACKAGE PREPARATION METHOD'

Simplified Explanation

This abstract describes a chip package technology that includes various components such as a substrate, a die, a first protection structure, and a blocking structure. The first protection structure wraps around the side surface of the die, while the blocking structure wraps around a surface of the first protection structure that is away from the die. The first surface of the die, the first surface of the first protection structure, and the first surface of the blocking structure are all aligned and flush with each other. These surfaces are all away from the substrate, which is another component of the chip package.


Original Abstract Submitted

The technology of this application relates to a chip package that includes a substrate, a die, a first protection structure, and a blocking structure. The first protection structure wraps a side surface of the die, the blocking structure wraps a surface that is of the first protection structure and that is away from the die, and a first surface of the die, a first surface of the first protection structure, and a first surface of the blocking structure are flush. The first surface of the die is a surface that is of the die and that is away from the substrate, the first surface of the first protection structure is a surface that is of the first protection structure and that is away from the substrate, and the first surface of the blocking structure is a surface that is of the blocking structure and that is away from the substrate.

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