Applied materials, inc. (20240266231). CYLINDRIC DECOMPOSITION FOR EFFICIENT MITIGATION OF SUBSTRATE DEFORMATION WITH FILM DEPOSITION AND ION IMPLANTATION simplified abstract
CYLINDRIC DECOMPOSITION FOR EFFICIENT MITIGATION OF SUBSTRATE DEFORMATION WITH FILM DEPOSITION AND ION IMPLANTATION
Organization Name
Inventor(s)
Pradeep Kumar Subrahmanyan of San Jose CA (US)
D. Jeffrey Lischer of Acton MA (US)
Frank Sinclair of Hartland ME (US)
CYLINDRIC DECOMPOSITION FOR EFFICIENT MITIGATION OF SUBSTRATE DEFORMATION WITH FILM DEPOSITION AND ION IMPLANTATION - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240266231 titled 'CYLINDRIC DECOMPOSITION FOR EFFICIENT MITIGATION OF SUBSTRATE DEFORMATION WITH FILM DEPOSITION AND ION IMPLANTATION
The disclosed systems and techniques aim to correct an out-of-plane deformation (OPD) of a substrate using optical inspection data to obtain an OPD profile and determine polynomial coefficients characterizing elemental deformation shapes.
- Obtain an OPD profile of the substrate using optical inspection data.
- Determine polynomial coefficients characterizing elemental deformation shapes of the substrate.
- Identify cylindric decompositions of a quadratic part of the OPD profile.
- Compute characteristics of a stress-compensation layer (SCL) using the selected cylindric decomposition.
- Deposit the SCL on the substrate and expose it to a stress-mitigation beam.
Potential Applications: - Semiconductor manufacturing - Optics industry - Aerospace industry
Problems Solved: - Correcting out-of-plane deformations of substrates - Improving substrate quality and performance
Benefits: - Enhanced substrate quality - Increased manufacturing precision - Improved overall product performance
Commercial Applications: Title: Advanced Substrate Deformation Correction Technology This technology can be utilized in semiconductor manufacturing, optics production, and aerospace applications to enhance product quality and performance. The market implications include improved efficiency, reduced waste, and enhanced competitiveness in the industry.
Questions about Substrate Deformation Correction Technology: 1. How does the technology of correcting out-of-plane deformations benefit the semiconductor industry?
- The technology improves substrate quality, leading to enhanced performance and reliability of semiconductor devices.
2. What are the potential applications of this technology in the aerospace industry?
- This technology can be used to improve the quality and performance of aerospace components, ensuring safety and reliability in critical applications.
Original Abstract Submitted
disclosed systems and techniques are directed to correct an out-of-plane deformation (opd) of a substrate. the techniques include obtaining, using optical inspection data, an opd profile of the substrate and obtaining a polynomial representation of the opd profile to determine a plurality of polynomial coefficients characterizing respective elemental deformation shapes of the substrate. the techniques further include identifying one or more cylindric decompositions of a quadratic part of the opd profile and computing, using a selected cylindric decomposition of the one or more cylindric decompositions, one or more characteristics of a stress-compensation layer (scl) for the substrate. the techniques further include causing the scl to be deposited on the substrate and the scl to be exposed to a stress-mitigation beam.
