Applied Materials, Inc. (20240339302). ELECTRICAL BREAK FOR SUBSTRATE PROCESSING SYSTEMS simplified abstract
Contents
ELECTRICAL BREAK FOR SUBSTRATE PROCESSING SYSTEMS
Organization Name
Inventor(s)
Yogananda Sarode Vishwanath of Bangalore (IN)
Andrew Nguyen of San Jose CA (US)
Tom K. Cho of Los Altos Hills CA (US)
ELECTRICAL BREAK FOR SUBSTRATE PROCESSING SYSTEMS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240339302 titled 'ELECTRICAL BREAK FOR SUBSTRATE PROCESSING SYSTEMS
Simplified Explanation: The patent application describes a gas break structure used in semiconductor processing systems, designed to regulate gas flow between a grounded gas distribution manifold and an electrically charged gas delivery nozzle.
- The gas break structure is made of insulating material and contains one or more gas flow paths.
- It is designed to provide a specified impedance to control the flow of gas.
- The internal structure of the gas break includes a repeating pattern with empty gaps between elements.
- Additive manufacturing can be used to create the gas break.
Key Features and Innovation: - Gas break structure for semiconductor processing systems - Insulating material with gas flow paths - Specified impedance control - Repeating internal structure with empty gaps - Additive manufacturing for fabrication
Potential Applications: The technology can be applied in semiconductor manufacturing, gas delivery systems, and other industries requiring precise gas flow control.
Problems Solved: The gas break structure addresses issues related to gas flow regulation, impedance control, and preventing electrical discharge in semiconductor processing systems.
Benefits: - Improved gas flow control - Enhanced safety in semiconductor processing - Efficient fabrication using additive manufacturing - Customizable design for specific applications
Commercial Applications: Gas break structures can be utilized in semiconductor fabrication plants, gas distribution systems, and other industrial settings requiring precise gas flow management.
Prior Art: Readers can explore prior patents related to gas flow control in semiconductor processing systems to understand the evolution of this technology.
Frequently Updated Research: Stay informed about the latest advancements in gas flow control technologies and additive manufacturing techniques for semiconductor processing systems.
Questions about Gas Break Structures: 1. What are the key advantages of using a gas break structure in semiconductor processing systems? 2. How does the design of the gas break structure contribute to efficient gas flow regulation?
Original Abstract Submitted
systems, methods, and apparatus including designs embodied in machine-readable media for a gas break used in semiconductor processing systems. the apparatus includes a gas break structure comprising an insulating material and having one or more gas flow paths formed within a body of the gas break structure, the gas break structure configured to provide a specified impedance when coupled between a grounded gas distribution manifold and an electrically charged gas delivery nozzle, the gas break structure further comprising an internal structure having a specified geometry comprising a repeating structure and one or more empty gaps between elements of the repeating structure. the gas break can be formed using additive manufacturing.
