Apple inc. (20240357271). HEADPHONES WITH INCREASED BACK VOLUME simplified abstract
Contents
HEADPHONES WITH INCREASED BACK VOLUME
Organization Name
Inventor(s)
Edward Siahaan of San Francisco CA (US)
Daniel R. Bloom of Alameda CA (US)
Jason J. Leblanc of Castro Valley CA (US)
HEADPHONES WITH INCREASED BACK VOLUME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240357271 titled 'HEADPHONES WITH INCREASED BACK VOLUME
The patent application discusses features for circumaural and supra-aural headphones, including earpad assemblies for improved acoustic isolation and user convenience features like automatically detecting headphone orientation on a user's head. Various power-saving, design, sensor configurations, and user comfort features are also covered.
- Earpad assemblies for improved acoustic isolation
- User convenience features like automatic headphone orientation detection
- Power-saving features
- Design features
- Sensor configurations
- User comfort features
Potential Applications: The technology can be applied in the design and manufacturing of high-quality headphones for both professional and consumer use. It can also be integrated into communication devices for improved audio quality and user experience.
Problems Solved: The technology addresses the need for better acoustic isolation in headphones, as well as the convenience of automatically adjusting to the user's head orientation. It also tackles power-saving concerns and enhances overall user comfort.
Benefits: Improved acoustic isolation Enhanced user convenience Power-saving capabilities Better user comfort High-quality audio experience
Commercial Applications: The technology can be utilized in the production of premium headphones for audiophiles, gaming headsets, communication devices, and other audio equipment. It has the potential to enhance the market competitiveness of headphone manufacturers and improve user satisfaction.
Prior Art: Readers can explore prior patents related to headphone design, acoustic isolation technologies, and user interface features to gain a deeper understanding of the innovation presented in this patent application.
Frequently Updated Research: Stay informed about advancements in headphone technology, acoustic engineering, and user interface design to further enhance the development and implementation of the features described in this patent application.
Questions about Headphone Design: 1. How does the technology in this patent application improve user comfort in headphone design? The technology enhances user comfort by automatically detecting the orientation of the headphones on the user's head, ensuring a secure and comfortable fit. 2. What are the potential market implications of integrating these features into headphone designs? By incorporating these features, headphone manufacturers can differentiate their products in the market, attract more customers, and improve overall user satisfaction.
Original Abstract Submitted
this disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. designs that include earpad assemblies that improve acoustic isolation are discussed. user convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. various power-saving features, design features, sensor configurations and user comfort features are also discussed.
