Apple inc. (20240353440). SENSOR ASSEMBLY simplified abstract

SENSOR ASSEMBLY

Organization Name

apple inc.

Inventor(s)

Aidan N. Zimmerman of Sunnyvale CA (US)

Ivan S. Maric of San Francisco CA (US)

Nicholas C. Soldner of Mountain View CA (US)

Jose A. Rios of Danville CA (US)

Stergios Roumeliotis of Los Altos Hills CA (US)

David S. Gragnolati of San Francisco CA (US)

SENSOR ASSEMBLY - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240353440 titled 'SENSOR ASSEMBLY

The sensor assembly for a head-mountable device includes a flex circuit, an inertial measurement unit, and an enclosure to securely support sensors while maintaining their positions and orientations over time.

• The sensor assembly comprises a flex circuit and an inertial measurement unit coupled to it.
• An enclosure surrounds the inertial measurement unit and a portion of the flex circuit to create a sealed volume containing the sensors.
• The sealed enclosure isolates the sensors from the external environment, maintaining their operable connection.
• The design ensures high robustness throughout the service life of the head-mountable device without straining the sensors.
• The seal of the enclosure prevents ingress of external elements, protecting the sensors from external influences.

Potential Applications: - Virtual reality headsets - Augmented reality devices - Wearable technology for fitness tracking

Problems Solved: - Maintaining sensor positions and orientations over time - Protecting sensors from external elements - Ensuring robustness and longevity of sensor functionality

Benefits: - Secure support for sensors - Maintained sensor positions and orientations - Isolation from external influences - High robustness and longevity

Commercial Applications: Title: "Enhanced Sensor Assembly for Head-Mountable Devices" This technology can be used in the development of advanced virtual reality headsets, augmented reality devices, and wearable fitness trackers, enhancing their performance and durability in various commercial applications.

Questions about the technology: 1. How does the sealed enclosure protect the sensors from external influences? The sealed enclosure prevents the ingress of elements through the case and plate, isolating the sensors from external influences effectively.

2. What are the key features of the sensor assembly for head-mountable devices? The key features include a flex circuit, an inertial measurement unit, and an enclosure that securely supports sensors while maintaining their positions and orientations over time.

Original Abstract Submitted

a sensor assembly for a head-mountable device, the sensor assembly comprising: a flex circuit, an inertial measurement unit coupled to the flex circuit, an enclosure disposed around the inertial measurement unit and a portion of the flex circuit, to define a sealed volume containing the inertial measurement unit and the portion of the flex circuit. thereby, a head-mountable device can securely support sensors in a manner that maintains their positions and orientations over time and isolates the sensors from an external environment. the sensor can be mounted within a sealed enclosure while maintaining an operable connection to the sensor. the sensor assemblies provides high robustness during the entirety of the service life of the head-mountable device without placing strain on the sensors themselves. the seal of the enclosure can isolate the sensor from external influences by preventing ingress of elements through the case and plate.