Apple inc. (20240347516). MICRO LED BASED DISPLAY PANEL simplified abstract
Contents
MICRO LED BASED DISPLAY PANEL
Organization Name
Inventor(s)
Dmitry S. Sizov of Cupertino CA (US)
Ion Bita of Santa Clara CA (US)
Jean-Jacques P. Drolet of Bavaria (DE)
John T. Leonard of San Jose CA (US)
Jonathan S. Steckel of Cupertino CA (US)
Nathaniel T. Lawrence of San Francisco CA (US)
Xiaobin Xin of Sunnyvale CA (US)
Ranojoy Bose of Fremont CA (US)
MICRO LED BASED DISPLAY PANEL - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240347516 titled 'MICRO LED BASED DISPLAY PANEL
The abstract describes the fabrication of light emitting structures, specifically LED mesa structures, which are transferred to a display substrate. These structures include LEDs with different thicknesses and corresponding bottom contacts with different thicknesses.
- LED coupons are transferred to a carrier substrate and patterned to LED mesa structures.
- Patterning can be done on heterogeneous groups of LED coupons using a common mask set.
- LED mesa structures are then bulk transferred to a display substrate.
- The light emitting structure includes LEDs with varying thicknesses and corresponding bottom contacts with different thicknesses.
- The innovation allows for the creation of complex LED arrangements on display substrates.
Potential Applications: - Display technology - Lighting applications - Signage and advertising
Problems Solved: - Efficient fabrication of LED structures - Creation of complex LED arrangements - Improved display technology
Benefits: - Enhanced display quality - Energy-efficient lighting solutions - Customizable LED arrangements
Commercial Applications: Title: Advanced LED Display Technology for Enhanced Visual Experiences This technology can be used in various commercial applications such as high-resolution displays, digital signage, and architectural lighting.
Questions about LED Mesa Structures: 1. How does the fabrication process of LED mesa structures differ from traditional LED manufacturing methods? The fabrication process involves transferring LED coupons to a carrier substrate, patterning them, and then bulk transferring them to a display substrate, allowing for the creation of complex LED arrangements.
2. What are the advantages of using LED mesa structures with varying thicknesses and bottom contacts? LED mesa structures with different thicknesses and bottom contacts allow for more flexibility in designing and customizing LED arrangements, leading to improved display quality and energy efficiency.
Original Abstract Submitted
light emitting structures and methods of fabrication are described. in an embodiment, led coupons are transferred to a carrier substrate and then patterned to led mesa structures. patterning may be performed on heterogeneous groups of led coupons with a common mask set. the led mesa structure are then transferred in bulk to a display substrate. in an embodiment, a light emitting structure includes an arrangement of leds with different thickness, and corresponding bottom contacts with different thicknesses bonded to a display substrate.
- Apple inc.
- Dmitry S. Sizov of Cupertino CA (US)
- Ion Bita of Santa Clara CA (US)
- Jean-Jacques P. Drolet of Bavaria (DE)
- John T. Leonard of San Jose CA (US)
- Jonathan S. Steckel of Cupertino CA (US)
- Nathaniel T. Lawrence of San Francisco CA (US)
- Xiaobin Xin of Sunnyvale CA (US)
- Ranojoy Bose of Fremont CA (US)
- H01L25/075
- H01L23/00
- H01L25/16
- H01L25/18
- H01L33/00
- H01L33/38
- H01L33/60
- CPC H01L25/0753