Apple inc. (20240291230). Laser Integration Techniques simplified abstract
Contents
Laser Integration Techniques
Organization Name
Inventor(s)
Michael J. Bishop of Waterloo (CA)
Jason Pelc of Sunnyvale CA (US)
Vijay M. Iyer of Mammoth Lakes CA (US)
Alex Goldis of San Francisco CA (US)
Laser Integration Techniques - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240291230 titled 'Laser Integration Techniques
The patent application describes methods for integrating an optical component into an integrated photonics device, including a light source, an outcoupler, or both, bonded to a wafer with a cavity and encapsulated with insulating materials.
- The die with the optical component is bonded to a wafer with a cavity.
- Insulating materials, such as an overmold, surround the edges of the die.
- Conductive posts are surrounded by insulating materials.
- Grinding and polishing process removes portions of the die, overmold, and conductive posts to create a planar top surface.
- The planar top surface enables flip-chip bonding and improved connection to a heat sink.
- Additional conductive layers and/or insulating layers are formed, and the p-side and n-side contacts of the laser are electrically connected to a source.
Potential Applications: - Integrated photonics devices - Optical communication systems - Laser technology
Problems Solved: - Integration of optical components into devices - Improved thermal management - Enhanced electrical connections
Benefits: - Enhanced performance of integrated photonics devices - Improved heat dissipation - Simplified manufacturing process
Commercial Applications: Title: "Advanced Integrated Photonics Devices for Optical Communication Systems" This technology can be used in the development of high-performance optical communication systems, leading to faster data transmission and improved network efficiency.
Questions about Integrated Photonics Devices: 1. How does the integration of optical components into a device impact its overall performance? 2. What are the key advantages of using insulating materials in the encapsulation process?
Frequently Updated Research: Ongoing research focuses on further optimizing the integration process of optical components into integrated photonics devices to enhance their efficiency and reliability.
Original Abstract Submitted
described herein are one or more methods for integrating an optical component into an integrated photonics device. the die including a light source, an outcoupler, or both, may be bonded to a wafer having a cavity. the die can be encapsulated using an insulating material, such as an overmold, that surrounds its edges. another (or the same) insulating material can surround conductive posts. portions of the die, the overmold, and optionally, the conductive posts can be removed using a grinding and polishing process to create a planar top surface. the planar top surface enables flip-chip bonding and an improved connection to a heat sink. the process can continue with forming one or more additional conductive layers and/or insulating layers and electrically connecting the p-side and n-side contacts of the laser to a source.
