Apple inc. (20240192506). Device With Molded Polymer Structures simplified abstract
Contents
Device With Molded Polymer Structures
Organization Name
Inventor(s)
Christopher Patton of San Jose CA (US)
Michael J. Oudenhoven of San Francisco CA (US)
Suresh C. Gopalan of San Jose CA (US)
Device With Molded Polymer Structures - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240192506 titled 'Device With Molded Polymer Structures
The abstract describes a patent application for a head-mounted device with a metal frame member that provides structural support and houses circuitry such as strain gauge circuitry and cabling. A protective polymer like thermoset epoxy encapsulates and protects the circuitry, allowing for injection molding operations without exposing the circuitry to elevated temperatures.
- The head-mounted device includes left and right lenses mounted in lens openings on the frame.
- The lenses have waveguides that guide images from projectors to eye boxes for user viewing.
- The metal frame member supports the frame and houses circuitry like strain gauge circuitry and cabling.
- A protective polymer like thermoset epoxy encapsulates and protects the circuitry from exposure to elevated temperatures during injection molding.
- Injection molding is used to apply thermoplastic polymer to the metal frame member to form the head-mounted frame.
Potential Applications: - Augmented reality and virtual reality headsets - Medical devices for visualization and imaging - Industrial applications for hands-free operation
Problems Solved: - Protecting circuitry from heat during manufacturing processes - Providing structural support for head-mounted devices - Ensuring durability and longevity of the device
Benefits: - Enhanced user experience with clear and guided image projection - Increased reliability and longevity of the device - Simplified manufacturing process with injection molding technology
Commercial Applications: Title: "Innovative Head-Mounted Device for Enhanced Visualization" This technology can be used in the development of consumer-grade augmented reality headsets, medical imaging devices, and industrial applications for hands-free operation. The market implications include improved user experience, increased demand for advanced visualization technologies, and potential growth in the AR/VR market.
Questions about Head-Mounted Device Technology: 1. How does the protective polymer encapsulation benefit the circuitry in the head-mounted device? 2. What are the key features that differentiate this head-mounted device from existing technologies?
Frequently Updated Research: Stay updated on advancements in injection molding technology for head-mounted devices, as well as developments in protective polymer materials for circuitry encapsulation.
Original Abstract Submitted
a head-mounted device may have a head-mounted frame with lens openings. the head-mounted device may have left and right lenses mounted in the lens openings. the lenses may include waveguides that help guide images from projectors to eye boxes for viewing by a user. the frame may include a metal frame member that supplies the frame with structural support. circuitry such as strain gauge circuitry and cabling may be coupled to the metal frame member. a protective polymer such as thermoset epoxy may be used to encapsulate and protect the circuitry. the protective polymer may encapsulate the strain gauge, the cabling, and/or other circuitry so that this circuitry need not be exposed to elevated temperatures during subsequent injection molding operations. injection molding may be used to apply one or more shots of thermoplastic polymer to the metal frame member to form the head-mounted frame.
