Apple inc. (20240105639). COMPRESSION STRUCTURES FOR IC PACKAGES simplified abstract

COMPRESSION STRUCTURES FOR IC PACKAGES

Organization Name

apple inc.

Inventor(s)

Helia Rahmani of Mountain View CA (US)

Stephane J. Marcadet of San Mateo CA (US)

Scott J. Campbell of Sunnyvale CA (US)

Zhiyong C. Xia of San Jose CA (US)

Stephen V. Jayanathan of Seattle WA (US)

Vineet Negi of Sunnyvale CA (US)

Christian Kettenbeil of Sunnyvale CA (US)

COMPRESSION STRUCTURES FOR IC PACKAGES - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240105639 titled 'COMPRESSION STRUCTURES FOR IC PACKAGES

Simplified Explanation

The patent application focuses on protecting interconnections between components and boards in electronic devices from damage caused by physical shocks. This is achieved by managing differential forces between the component and the board during shock events.

• Structures, methods, and apparatus are designed to protect interconnections in electronic devices from damage due to physical shocks.
• Differential compression forces are utilized to counteract differential tensile forces between components and boards during shock events.
• Techniques are implemented to reduce or prevent damage by minimizing differential tensile forces between components and boards.
• Components can be securely attached to boards to directly lessen the differential force and prevent damage.

Potential Applications

The technology can be applied in various electronic devices such as smartphones, tablets, laptops, and wearables to enhance their durability and reliability.

Problems Solved

1. Damage prevention: The innovation addresses the issue of interconnection damage caused by physical shocks, ensuring the longevity of electronic devices. 2. Enhanced stability: By managing differential forces, the technology improves the stability of components within electronic devices, reducing the risk of malfunctions.

Benefits

1. Increased durability: By protecting interconnections, the technology prolongs the lifespan of electronic devices. 2. Improved reliability: The innovation enhances the reliability of electronic devices by minimizing the impact of physical shocks on internal components.

Potential Commercial Applications

"Enhancing Durability in Electronic Devices: Applications of Interconnection Protection Technology"

Possible Prior Art

There may be existing patents or technologies related to shock-absorbing materials or structures used in electronic devices to prevent damage from physical impacts.

How does this technology compare to existing shock-absorbing solutions in electronic devices?

The article does not provide a direct comparison with other shock-absorbing technologies currently available in the market.

What specific electronic devices can benefit the most from this innovation?

The article does not specify which electronic devices would see the most significant improvements from implementing this technology.

Original Abstract Submitted

structures, methods, and apparatus for protecting interconnections between components and boards in an electronic device from damage resulting from a physical shock. this damage can occur due to differential tensile forces being applied between the component and the board during a drop or other shock event. an example can reduce or prevent damage by providing differential compression forces between the component and board that can cancel differential tensile forces between the component and board during the shock event. another example can reduce or prevent damage by reducing differential tensile forces between a component and board. another example can secure a component to the board to directly reduce the differential force in order to prevent damage.