ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. Patent Application Trends in 2024
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Contents
- 1 ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. Patent Filing Activity
- 2 ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. patent applications in 2024
- 3 Top 10 Technology Areas
- 4 Emerging Technology Areas
- 5 Top Inventors
- 6 Patent Categories
- 7 Geographical Distribution of Inventors
- 8 Geographical Distribution of US Inventors
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. Patent Filing Activity
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. patent applications in 2024
Top 10 Technology Areas
- H01L24/80 ({Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected})
- H01L24/08 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L2224/80896 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L2224/80895 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L25/0657 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L2224/08145 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L24/05 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L24/03 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- Count: 8 patents
- Example: 20240120245. BONDED STRUCTURES simplified abstract (ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.)
- H01L24/09 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- Count: 8 patents
- Example: 20240120245. BONDED STRUCTURES simplified abstract (ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.)
- H01L24/83 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
Emerging Technology Areas
- H01L23/3178 ({Coating or filling in grooves made in the semiconductor body})
- Count: 1 patents
- Example: 20240047344. INTERCONNECT STRUCTURES simplified abstract (ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.)
- H01L23/298 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- Count: 1 patents
- Example: 20240047344. INTERCONNECT STRUCTURES simplified abstract (ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.)
- H01L24/20 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- Count: 1 patents
- Example: 20240047344. INTERCONNECT STRUCTURES simplified abstract (ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.)
- H01L2924/0665 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L2224/80052 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L2224/8001 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L24/799 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L2224/80205 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L2924/04941 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L2224/94 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
Top Inventors
- Belgacem Haba of Saratoga CA (US) (18 patents)
- Cyprian Emeka Uzoh of San Jose CA (US) (18 patents)
- Rajesh Katkar of Milpitas CA (US) (13 patents)
- Gaius Gillman Fountain, JR. of Youngsville NC (US) (8 patents)
- Guilian Gao of San Jose CA (US) (7 patents)
- Jeremy Alfred Theil of Mountain View CA (US) (6 patents)
- Laura Wills Mirkarimi of Sunol CA (US) (6 patents)
- Thomas Workman of San Jose CA (US) (5 patents)
- Javier A. DeLaCruz of San Jose CA (US) (4 patents)
- Bongsub Lee of Santa Clara CA (US) (4 patents)
Patent Categories
Geographical Distribution of Inventors
Geographical Distribution of US Inventors
Categories:
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Companies
- CPC H01L21/31053
- CPC H01L21/0217
- CPC H01L21/31111
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- CPC H01L2224/83031
- CPC H01L2224/83896
- CPC H01L24/08
- CPC H01L23/3121
- CPC H01L23/5383
- CPC H01L24/05
- CPC H01L24/80
- CPC H01L24/96
- CPC H01L24/97
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- CPC H01L2224/05647
- CPC H01L2224/08235
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- CPC H01L23/5286
- CPC H01L23/5389
- CPC H01L24/17
- CPC H01L25/16
- CPC H01L28/60
- CPC H01L2924/1205
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