3D Printing patent applications on October 17th, 2024

Patent Applications for 3D Printing on October 17th, 2024

Number of patent applications containing '3D Printing' or its variations: 30

Carlsmed, Inc. (20240341973). SYSTEMS AND METHODS FOR ORTHOPEDIC IMPLANT FIXATION simplified abstract

Organization: Carlsmed, Inc.

Inventor(s): Niall Patrick Casey of Carlsbad CA (US) for Carlsmed, Inc., Michael J. Cordonnier of Carlsbad CA (US) for Carlsmed, Inc.

IPC Code(s): A61F2/44, A61B17/56, A61B17/70, A61B17/80, A61B34/10, A61F2/30

CPC Code(s): A61F2/4455

TUSAS- TURK HAVACILIK VE UZAY SANAYII ANONIM SIRKETI (20240342796). A POWDER PRODUCTION SYSTEM simplified abstract

Organization: TUSAS- TURK HAVACILIK VE UZAY SANAYII ANONIM SIRKETI

Inventor(s): Sertac ALTINOK of Kahramankazan/Ankara (TR) for TUSAS- TURK HAVACILIK VE UZAY SANAYII ANONIM SIRKETI

IPC Code(s): B22F9/14, B22F9/08, B33Y70/00

CPC Code(s): B22F9/14

Headmade Materials GmbH (20240342797). BINDER COMPONENT FOR A PARTICULATE FEEDSTOCK COMPOUND FOR USE IN A SHAPING AND SINTERING PROCESS, PARTICULATE FEEDSTOCK COMPOUND, AND SHAPING AND SINTERING PROCESS simplified abstract

Organization: Headmade Materials GmbH

Inventor(s): Christian STAUDIGEL of Unterpleichfeld (DE) for Headmade Materials GmbH, Christian FISCHER of Unterpleichfeld (DE) for Headmade Materials GmbH

IPC Code(s): B22F10/16, B33Y10/00, B33Y70/10, C08K3/00, C08L81/10, C08L91/06

CPC Code(s): B22F10/16

THE BOEING COMPANY (20240342799). METHODS OF PRECISELY REGULATING A PROCESS GAS FLOW THROUGH A PROCESS CHAMBER OF AN ADDITIVE MANUFACTURING SYSTEM AND ADDITIVE MANUFACTURING SYSTEMS THAT PERFORM THE METHODS simplified abstract

Organization: THE BOEING COMPANY

Inventor(s): Dalton W. Hamburg of Bothell WA (US) for THE BOEING COMPANY

IPC Code(s): B22F10/322, B22F12/70, B22F12/90, B33Y30/00, B33Y50/02

CPC Code(s): B22F10/322

Howmedica Osteonics Corp. (20240342800). Implant Support Structure And Method Of Fabrication Of Implant Using The Same simplified abstract

Organization: Howmedica Osteonics Corp.

Inventor(s): Heinrich George Crous of Cork (IE) for Howmedica Osteonics Corp.

IPC Code(s): B22F10/47, A61F2/30, A61F2/36, B22F10/28, B33Y10/00

CPC Code(s): B22F10/47

General Electric Company (20240342801). SYSTEM AND METHOD FOR ELIMINATING SURFACE DEFECTS IN AN ADDITIVELY MANUFACTURED COMPONENT simplified abstract

Organization: General Electric Company

Inventor(s): Thomas Charles Adcock of Glenville NY (US) for General Electric Company, Brian Scott McCarthy of Clifton Park NY (US) for General Electric Company

IPC Code(s): B22F10/85, B22F10/28, B22F10/366, B22F12/45, B22F12/49, B22F12/90, B23K26/06, B23K26/342, B33Y10/00, B33Y30/00, B33Y50/02

CPC Code(s): B22F10/85

THE INDIUM CORPORATION OF AMERICA (20240342802). BUILD PLATE WITH INTERCHANGEABLE INSERT TO REDUCE LIFT-UP DURING METAL 3D PRINTING simplified abstract

Organization: THE INDIUM CORPORATION OF AMERICA

Inventor(s): David P. Socha of Whitesboro NY (US) for THE INDIUM CORPORATION OF AMERICA, Brent Muncy of Sauquoit NY (US) for THE INDIUM CORPORATION OF AMERICA

IPC Code(s): B22F12/30, B33Y30/00

CPC Code(s): B22F12/30

Unknown Organization (20240342804). Multi-Parameter Inspection Apparatus for Monitoring of Manufacturing Parts simplified abstract

Organization: Unknown Organization

Inventor(s): Araz Yacoubian of Encinitas CA (US) for Unknown Organization

IPC Code(s): B22F12/90, B22F10/20, B22F10/30, B22F12/00, B29C64/393, B33Y30/00, B33Y50/00, B33Y50/02, G01N21/21, G01N21/47, G01N21/88, G01N21/95

CPC Code(s): B22F12/90

Nanchang Hangkong University (20240342823). WIRE-FEEDING ELECTROMAGNETIC SPRAY ADDITIVE MANUFACTURING DEVICE AND METHOD simplified abstract

Organization: Nanchang Hangkong University

Inventor(s): Timing ZHANG of Nanchang (CN) for Nanchang Hangkong University, Jilin XIE of Nanchang (CN) for Nanchang Hangkong University, Jinyang HU of Nanchang (CN) for Nanchang Hangkong University, Jianliang LIU of Nanchang (CN) for Nanchang Hangkong University, Shanlin WANG of Nanchang (CN) for Nanchang Hangkong University, Yuhua CHEN of Nanchang (CN) for Nanchang Hangkong University, Yang SHEN of Nanchang (CN) for Nanchang Hangkong University, Shiyi ZHANG of Nanchang (CN) for Nanchang Hangkong University, Guanpeng LIU of Nanchang (CN) for Nanchang Hangkong University, Mingwei WEI of Nanchang (CN) for Nanchang Hangkong University

IPC Code(s): B23K20/12, B23K20/06, B23K20/14, B33Y10/00, B33Y30/00

CPC Code(s): B23K20/1215

General Electric Company (20240342831). SYSTEMS AND METHODS FOR COMPRESSION, MANAGEMENT, AND ANALYSIS OF DOWNBEAM CAMERA DATA FOR AN ADDITIVE MACHINE simplified abstract

Organization: General Electric Company

Inventor(s): Naresh S. Iyer of Niskayuna NY (US) for General Electric Company, Subhrajit Roychowdhury of Niskayuna NY (US) for General Electric Company, Christopher D. Immer of Niskayuna NY (US) for General Electric Company, Xiaohu Ping of Niskayuna NY (US) for General Electric Company, Rogier S. Blom of Clifton Park NY (US) for General Electric Company, Jing Yu of Pasadena CA (US) for General Electric Company

IPC Code(s): B23K26/342, B23K26/03, B23K26/06, B23K26/073, B23K26/082, B23K31/00, B33Y10/00, B33Y30/00, B33Y50/02

CPC Code(s): B23K26/342

PERI SE (20240342953). CONTROL OF A 3D PRINTER FOR THE ADDITIVE MANUFACTURING OF BUILDINGS simplified abstract

Organization: PERI SE

Inventor(s): Maximilian LUTZ of Nuernberg (DE) for PERI SE, Yannick MACIEJEWSKI of Beilstein (DE) for PERI SE, Bruno TORRINHA of Krumbach (DE) for PERI SE, Fabian MEYER-BROETZ of Günzburg (DE) for PERI SE

IPC Code(s): B28B17/00, B28B1/00, B33Y50/02, B33Y70/00

CPC Code(s): B28B17/0081

Apis Cor Inc. (20240342955). METHOD AND APPARATUS FOR DELIVERY AND FEEDING OF MATERIAL AND ELECTRICITY FOR CONSTRUCTION 3D PRINTING simplified abstract

Organization: Apis Cor Inc.

Inventor(s): Nikita Cheniuntai of Melbourne FL (US) for Apis Cor Inc., Anna Cheniuntai of Melbourne FL (US) for Apis Cor Inc.

IPC Code(s): B28C7/04, B28B1/00, B28C7/00, B33Y40/00, B33Y50/02

CPC Code(s): B28C7/0418

The United States of America, as Represented by the Secretary of the Navy (20240342961). POLYMER MOLDING OF UNDERSEA CABLES AND CONNECTION USING ADDITIVE MANUFACTURING simplified abstract

Organization: The United States of America, as Represented by the Secretary of the Navy

Inventor(s): Matthew Johnson of Springville IN (US) for The United States of America, as Represented by the Secretary of the Navy, Joshua M. Jeffers of Loogootee IN (US) for The United States of America, as Represented by the Secretary of the Navy, William Riggins of Bloomington IN (US) for The United States of America, as Represented by the Secretary of the Navy

IPC Code(s): B29C33/38, B29B13/00, B29C45/00, B29C45/26, B29C45/73, B29C64/112, B29C64/35, B29C64/386, B29C64/40, B29K75/00, B29L31/00, B33Y30/00, B33Y40/20, B33Y50/00, B33Y80/00

CPC Code(s): B29C33/3842

Thermwood Corporation (20240342978). METHODS AND APPARATUS FOR COMPENSATING FOR MATERIAL DISTORTION DURING ADDITIVE MANUFACTURING simplified abstract

Organization: Thermwood Corporation

Inventor(s): Kenneth J. SUSNJARA of Birdseye IN (US) for Thermwood Corporation, Scott G. VAAL of Jasper IN (US) for Thermwood Corporation

IPC Code(s): B29C64/106, B29C64/194, B29C64/393, B33Y40/00, B33Y10/00, B33Y30/00, B33Y50/02

CPC Code(s): B29C64/106

ALTYMIK INC. (20240342979). ADDITIVE MANUFACTURING USING CARBON NANOTUBES AND FORMULATION FOR USE IN SAME simplified abstract

Organization: ALTYMIK INC.

Inventor(s): Daniel Slep of Setauket NY (US) for ALTYMIK INC., Fan Yang of South Setauket NY (US) for ALTYMIK INC.

IPC Code(s): B29C64/112, B29C64/209, B29C64/255, B29K507/04, B29L31/34, B33Y70/10, B33Y80/00, C08K3/04, C09D11/38

CPC Code(s): B29C64/112

Stratasys Ltd. (20240342980). 3D PRINTING TO OBTAIN A PREDEFINED SURFACE QUALITY simplified abstract

Organization: Stratasys Ltd.

Inventor(s): Guy MENCHIK of RaAnana (IL) for Stratasys Ltd., Yaniv SHITRIT of Ashkelon (IL) for Stratasys Ltd., Boris BELOCON of Rehovot (IL) for Stratasys Ltd., Yehoshua SHEINMAN of RaAnana (IL) for Stratasys Ltd., Daniel DIKOVSKY of Ariel (IL) for Stratasys Ltd.

IPC Code(s): B29C64/112, B29C64/245, B29C64/393, B29L31/34, B33Y10/00, B33Y30/00, B33Y50/02, B33Y70/00, B33Y80/00

CPC Code(s): B29C64/112

Thermwood Corporation (20240342982). APPARATUS AND METHOD FOR DEPOSITING MATERIAL DURING ADDITIVE MANUFACTURING simplified abstract

Organization: Thermwood Corporation

Inventor(s): Kenneth J. SUSNJARA of Birdseye IN (US) for Thermwood Corporation, Brian S. SMIDDY of Newburgh IN (US) for Thermwood Corporation, Jonathan L. FUQUAY of Boonville IN (US) for Thermwood Corporation

IPC Code(s): B29C64/118, B29C64/20, B29C64/218, B33Y10/00, B33Y30/00, B29K101/12

CPC Code(s): B29C64/118

The Regents of the University of Colorado, a Body Corporatate (20240342983). SYSTEMS AND METHODS FOR THREE-DIMENSIONAL PRINTING simplified abstract

Organization: The Regents of the University of Colorado, a Body Corporatate

Inventor(s): Charles Rackson of Boulder CO (US) for The Regents of the University of Colorado, a Body Corporatate

IPC Code(s): B29C64/124, B29C64/268, B29C64/291, B29K105/00, B33Y10/00, B33Y30/00

CPC Code(s): B29C64/124

ENTEGRIS, INC. (20240342984). POROUS SINTERED METAL BODIES AND METHODS OF PREPARING POROUS SINTERED METAL BODIES simplified abstract

Organization: ENTEGRIS, INC.

Inventor(s): Virendra Warke of North Chelmsford MA (US) for ENTEGRIS, INC., Meghan Patrick of Watertown MA (US) for ENTEGRIS, INC., Devon N. Dion of Nashua NH (US) for ENTEGRIS, INC., Subhash Guddati of Singapore (SG) for ENTEGRIS, INC., Montray Leavy of Singapore (SG) for ENTEGRIS, INC.

IPC Code(s): B29C64/153, B01D67/00, B01D69/06, B01D71/02, B22F7/02, B29C64/268, B33Y10/00, B33Y30/00

CPC Code(s): B29C64/153

Hewlett-Packard Development Company, L.P. (20240342987). THREE-DIMENSIONAL PRINTING OF SCREENS simplified abstract

Organization: Hewlett-Packard Development Company, L.P.

Inventor(s): John BRIDEN of Palo Alto CA (US) for Hewlett-Packard Development Company, L.P., Emre DISCEKICI of San Diego CA (US) for Hewlett-Packard Development Company, L.P., Oriol VAQUER ARNAU of Sant Cugat del Valles (ES) for Hewlett-Packard Development Company, L.P.

IPC Code(s): B29C64/165, B29C64/393, B29L31/00, B33Y50/02, B33Y80/00

CPC Code(s): B29C64/165

CORNELL UNIVERSITY (20240342989). CONTROLLED MOLTEN METAL DEPOSITION simplified abstract

Organization: CORNELL UNIVERSITY

Inventor(s): ATIEH MORIDI of Ithaca NY (US) for CORNELL UNIVERSITY, KAUSHALENDRA K. SINGH of Ithaca NY (US) for CORNELL UNIVERSITY

IPC Code(s): B29C64/273, B22F10/22, B22F10/25, B22F12/43, B29C64/223, B29C64/236, B29C64/245, B29C64/321, B29C64/371, B33Y10/00, B33Y30/00, B33Y40/00, C23C14/04

CPC Code(s): B29C64/273

Structo Pte Ltd (20240342990). ADDITIVE MANUFACTURING DEVICE AND METHOD simplified abstract

Organization: Structo Pte Ltd

Inventor(s): Hubertus Theodorus Petrus VAN ESBROECK of Singapore (SG) for Structo Pte Ltd, Shanmugam MURUGA PALANIAPPAN of Singapore (SG) for Structo Pte Ltd, Devansh SHARMA of Singapore (SG) for Structo Pte Ltd, Siu Hon LAM of Singapore (SG) for Structo Pte Ltd, Kah Fai CHIN of Singapore (SG) for Structo Pte Ltd, Yong Chuan Randall SIE of Singapore (SG) for Structo Pte Ltd

IPC Code(s): B29C64/286, B29C64/245, B29C64/255, B33Y30/00

CPC Code(s): B29C64/286

BOND HIGH PERFORMANCE 3D TECHNOLOGY B.V. (20240342991). ADDITIVE MANUFACTURING APPARATUS HAVING A CARTRIDGE CONTAINING RODS OF MODELLING MATERIAL AND CARTRIDGE FOR SUCH AN APPARATUS simplified abstract

Organization: BOND HIGH PERFORMANCE 3D TECHNOLOGY B.V.

Inventor(s): Marald SPEELMAN of Enschede (NL) for BOND HIGH PERFORMANCE 3D TECHNOLOGY B.V., Klaas GROEN of Enschede (NL) for BOND HIGH PERFORMANCE 3D TECHNOLOGY B.V., Gerard Folkert MULDER of Enschede (NL) for BOND HIGH PERFORMANCE 3D TECHNOLOGY B.V., Kevin Hendrik Jozef VOSS of Enschede (NL) for BOND HIGH PERFORMANCE 3D TECHNOLOGY B.V., Martijn Johannes WOLBERS of Enschede (NL) for BOND HIGH PERFORMANCE 3D TECHNOLOGY B.V.

IPC Code(s): B29C64/321, B29C64/259, B33Y30/00

CPC Code(s): B29C64/321

SHENZHEN ANYCUBIC TECHNOLOGY CO., LTD. (20240342992). PRINTING CONSUMABLE CONVEYOR AND 3D PRINTER simplified abstract

Organization: SHENZHEN ANYCUBIC TECHNOLOGY CO., LTD.

Inventor(s): Qiming LIAO of Shenzhen (CN) for SHENZHEN ANYCUBIC TECHNOLOGY CO., LTD.

IPC Code(s): B29C64/321, B33Y30/00

CPC Code(s): B29C64/321

Voxeljet AG (20240342994). CLOSURE DEVICE, 3D PRINTING DEVICE AND METHOD FOR PRODUCING 3D-MOLDED PARTS simplified abstract

Organization: Voxeljet AG

Inventor(s): Josef GRASEGGER of Stadtbergen (DE) for Voxeljet AG, Bastian HEYMEL of Augsburg (DE) for Voxeljet AG, Wolfgang MÜHLBAUER of Augsburg (DE) for Voxeljet AG

IPC Code(s): B29C64/343, B29C64/153, B29C64/214, B29C64/329, B33Y10/00, B33Y30/00, B33Y40/00

CPC Code(s): B29C64/343

Unknown Organization (20240343000). CUSTOM, USER-SPECIFIC FIREARM GRIP AND METHOD OF MANUFACTURE simplified abstract

Organization: Unknown Organization

Inventor(s): Keith Bernkrant of Cocoa FL (US) for Unknown Organization, Simon Oliver of Lakeland TN (US) for Unknown Organization

IPC Code(s): B29C69/02, A63B60/12, B25G1/10, B29C37/00, B29C64/10, B29C64/386, B29K77/00, B29L31/00, B33Y10/00, B33Y50/00, B33Y70/00, B33Y80/00, F41C23/16

CPC Code(s): B29C69/02

Haze Automotive of America, Inc. (20240343017). CARBON FIBER COMPONENT BASED ELECTRIC VEHICLES simplified abstract

Organization: Haze Automotive of America, Inc.

Inventor(s): Sean Mario Hazaray of Northbrook IL (US) for Haze Automotive of America, Inc., Ramino Troy Beetz of Rancho Palos Verdes CA (US) for Haze Automotive of America, Inc.

IPC Code(s): B32B5/26, B32B3/12, B32B5/02, B32B15/14, B32B15/20, B33Y10/00, B33Y80/00

CPC Code(s): B32B5/26

SIGNIFY HOLDING B.V. (20240343915). 3D printed reflectors for disinfection lighting simplified abstract

Organization: SIGNIFY HOLDING B.V.

Inventor(s): TIES VAN BOMMEL of HORST (NL) for SIGNIFY HOLDING B.V., RIFAT ATA MUSTAFA HIKMET of EINDHOVEN (NL) for SIGNIFY HOLDING B.V., JACOBUS PETRUS JOHANNES VAN OS of EINDHOVEN (NL) for SIGNIFY HOLDING B.V.

IPC Code(s): C09D5/00, A61L9/20, B29C64/118, B29K27/18, B29K105/00, B29K105/16, B29K509/00, B29L11/00, B33Y10/00, B33Y70/10, B33Y80/00, C09D7/61, C09D127/18

CPC Code(s): C09D5/006

Molecular Rebar Design, LLC (20240343928). Coatings with Discrete Carbon Nanotubes for Energy Storage and Additive Manufacturing simplified abstract

Organization: Molecular Rebar Design, LLC

Inventor(s): Clive Paul Bosnyak of Dripping Springs TX (US) for Molecular Rebar Design, LLC

IPC Code(s): C09D7/62, B33Y70/10, C08K3/013, C08K3/02, C08K3/22, C08K9/08, C09D7/40, H01F1/14, H01M4/02, H01M4/36, H01M4/38, H01M4/525, H01M4/62

CPC Code(s): C09D7/62

City University of Hong Kong (20240344183). MULTI-COMPONENT HIGH ENTROPY ALLOY WITH NANOSCALE ATOMIC SELF-ORDERING STRUCTURE AND PREPARATION METHODS THEREOF simplified abstract

Organization: City University of Hong Kong

Inventor(s): Tao YANG of Hong Kong (HK) for City University of Hong Kong, Jiang JU of Hong Kong (HK) for City University of Hong Kong

IPC Code(s): C22C30/00, B22F9/10, B22F10/28, C22C1/04

CPC Code(s): C22C30/00