3D Printing patent applications on June 13th, 2024
Patent Applications for 3D Printing on June 13th, 2024
Number of patent applications containing '3D Printing' or its variations: 28
Organization: XEROX CORPORATION
Inventor(s): Daniel Bullard of Palo Alto CA (US) for XEROX CORPORATION, Patrick Y. Maeda of San Jose CA (US) for XEROX CORPORATION, Warren Jackson of San Francisco CA (US) for XEROX CORPORATION, David K. Biegelsen of Portola Valley CA (US) for XEROX CORPORATION
IPC Code(s): B22D23/00, B33Y10/00, B33Y30/00, B33Y50/02
CPC Code(s): B22D23/003
Organization: Northwestern Polytechnical University
Inventor(s): Haijun SU of Xi'an Shaanxi (CN) for Northwestern Polytechnical University, Yong ZHAO of Xi'an Shaanxi (CN) for Northwestern Polytechnical University, Meng WANG of Xi'an Shaanxi (CN) for Northwestern Polytechnical University, Jun ZHANG of Xi'an Shaanxi (CN) for Northwestern Polytechnical University, Min GUO of Xi'an Shaanxi (CN) for Northwestern Polytechnical University, Lin LIU of Xi'an Shaanxi (CN) for Northwestern Polytechnical University, Hengzhi FU of Xi'an Shaanxi (CN) for Northwestern Polytechnical University
IPC Code(s): B22F1/05, B22F1/142, B22F3/10, B22F3/105, B22F9/04, C22C19/05
CPC Code(s): B22F1/05
Organization: Lockheed Martin Corporation
Inventor(s): Zachary Loftus of Littleton CO (US) for Lockheed Martin Corporation, Scott William Cochran of Littleton CO (US) for Lockheed Martin Corporation, Michael A. Reale of San Jose CA (US) for Lockheed Martin Corporation, Scott Wesley Smith of Palo Alto CA (US) for Lockheed Martin Corporation
IPC Code(s): B22F1/12
CPC Code(s): B22F1/12
Organization: SAFRAN AIRCRAFT ENGINES
Inventor(s): Arnaud TUREL of MOISSY-CRAMAYEL (FR) for SAFRAN AIRCRAFT ENGINES, Mickaël VOIRON of MOISSY-CRAMAYEL (FR) for SAFRAN AIRCRAFT ENGINES
IPC Code(s): B22F10/66, B22F5/00, B22F10/28, B22F10/68, B23P15/02, B33Y10/00, B33Y40/20, B33Y80/00
CPC Code(s): B22F10/66
Organization: Baker Hughes Oilfield Operations LLC
Inventor(s): Thomas Dobrowolski of The Woodlands TX (US) for Baker Hughes Oilfield Operations LLC, Andrew Platt of Houston TX (US) for Baker Hughes Oilfield Operations LLC, Monte Lively of Houston TX (US) for Baker Hughes Oilfield Operations LLC
IPC Code(s): B22F10/68, B22F10/28, B22F10/66, B22F10/85, B22F12/30, B22F12/50, B22F12/60
CPC Code(s): B22F10/68
Organization: Divergent Technologies, Inc.
Inventor(s): Gordon TAJIRI of Los Angeles CA (US) for Divergent Technologies, Inc., Michael Thomas KENWORTHY of Rancho Palos Verdes CA (US) for Divergent Technologies, Inc., Mu Li of San Pedro CA (US) for Divergent Technologies, Inc., Chan Cheong Pun of Costa Mesa CA (US) for Divergent Technologies, Inc.
IPC Code(s): B22F10/85, B22F10/28, B22F10/36, B22F10/80, B22F12/41, B22F12/49, B22F12/50, B22F12/90, B33Y10/00, B33Y30/00, B33Y50/00, B33Y50/02
CPC Code(s): B22F10/85
Organization: INSTITUT DE RECHERCHE TECHNOLOGIQUE JULES VERNE
Inventor(s): Prigent SERGE of La Sappey en Chartreuse (FR) for INSTITUT DE RECHERCHE TECHNOLOGIQUE JULES VERNE
IPC Code(s): B22F12/20, B22F10/22, B22F10/50, B22F12/70, B33Y10/00, B33Y30/00, B33Y40/00, B33Y80/00
CPC Code(s): B22F12/20
Velo3D, Inc. (20240189912). THREE-DIMENSIONAL PRINTER COMPONENTS simplified abstract
Organization: Velo3D, Inc.
Inventor(s): Dean Albert TARRANT of Gilroy CA (US) for Velo3D, Inc., Joseph Andrew TRALONGO of El Cajon CA (US) for Velo3D, Inc., Benyamin BULLER of Cupertino CA (US) for Velo3D, Inc., Richard ROMANO of San Jose CA (US) for Velo3D, Inc., Thomas BREZOCZKY of Los Gatos CA (US) for Velo3D, Inc., Anatolii VITANOV of Milpitas CA (US) for Velo3D, Inc., Erel MILSHTEIN of Morgan Hill CA (US) for Velo3D, Inc., Gregory Ferguson BROWN of San Jose CA (US) for Velo3D, Inc., Robert MARTINSON of Palo Alto CA (US) for Velo3D, Inc., Daniel CHRISTIANSEN of Mountain View CA (US) for Velo3D, Inc., Alex BRUDNY of San Jose CA (US) for Velo3D, Inc.
IPC Code(s): B22F12/00, B29C64/236, B33Y30/00
CPC Code(s): B22F12/224
Organization: Illinois Tool Works Inc.
Inventor(s): Shuang Liu of Appleton WI (US) for Illinois Tool Works Inc., Erik Miller of Verona WI (US) for Illinois Tool Works Inc., Brian Doyle of Glenview IL (US) for Illinois Tool Works Inc.
IPC Code(s): B23K26/06, B23K26/082, B23K26/142, B23K26/244, B23K26/32, B23K26/342, B23K103/00
CPC Code(s): B23K26/0665
Organization: Hebei Quantum Intelligent Technology Co., Ltd.
Inventor(s): Chao ZHANG of Handan City (CN) for Hebei Quantum Intelligent Technology Co., Ltd., Yi ZHAO of Handan City (CN) for Hebei Quantum Intelligent Technology Co., Ltd., Gang LI of Handan City (CN) for Hebei Quantum Intelligent Technology Co., Ltd., Ruihua LI of Handan City (CN) for Hebei Quantum Intelligent Technology Co., Ltd., Jiawei WANG of Handan City (CN) for Hebei Quantum Intelligent Technology Co., Ltd., Chenhui LI of Handan City (CN) for Hebei Quantum Intelligent Technology Co., Ltd.
IPC Code(s): B28B1/00, B33Y70/10, C04B7/02, C04B7/32, C04B14/06, C04B16/02, C04B16/06, C04B18/06, C04B18/08, C04B22/10, C04B24/12, C04B24/26, C04B28/04, C04B28/06, C04B40/00
CPC Code(s): B28B1/001
Organization: SOLID LAB SDN BHD
Inventor(s): Jing Yuen TEY of Selangor (MY) for SOLID LAB SDN BHD, Wei Hong YEO of Selangor (MY) for SOLID LAB SDN BHD, Shiau Foon TEE of Selangor (MY) for SOLID LAB SDN BHD, Chee Yuen CHEONG of Kuala Lumpur (MY) for SOLID LAB SDN BHD
IPC Code(s): B28B1/00, B22F10/20, B28B1/14, B33Y10/00, B33Y30/00, B33Y70/10, C04B35/626, C04B35/636
CPC Code(s): B28B1/001
Organization: THE BOEING COMPANY
Inventor(s): Michael D. NEVINSKY of Media PA (US) for THE BOEING COMPANY, David Thomas MISCIAGNA of West Chester PA (US) for THE BOEING COMPANY, Michael Vincent D'OLIO of Philadelphia PA (US) for THE BOEING COMPANY, Christopher Jay FELKER of Downingtown PA (US) for THE BOEING COMPANY
IPC Code(s): B28B7/34, B22D23/00, B28B7/28, B33Y10/00, B33Y70/00, B33Y80/00
CPC Code(s): B28B7/346
Organization: ASPECT BIOSYSTEMS LTD.
Inventor(s): Simon Travis BEYER of Richmond (CA) for ASPECT BIOSYSTEMS LTD., Konrad WALUS of Vancouver (CA) for ASPECT BIOSYSTEMS LTD., Tamer MOHAMED of Richmond (CA) for ASPECT BIOSYSTEMS LTD., Anas Amjad Mohammad BSOUL of Vancouver (CA) for ASPECT BIOSYSTEMS LTD.
IPC Code(s): B29C64/106, B29C64/209, B29C70/00, B29K105/00, B33Y10/00, B33Y30/00, B33Y50/02, C12M1/26, C12M3/00, C12M3/06, C12N5/00, C12N11/04
CPC Code(s): B29C64/106
Organization: UNIVERSITIES SPACE RESEARCH ASSOCIATION
Inventor(s): Ramprasad Gandhiraman of Sunnyvale CA (US) for UNIVERSITIES SPACE RESEARCH ASSOCIATION, Meyya Meyyappan of Pacifica CA (US) for UNIVERSITIES SPACE RESEARCH ASSOCIATION, Jessica E. Koehne of Portola Valley CA (US) for UNIVERSITIES SPACE RESEARCH ASSOCIATION
IPC Code(s): B29C64/106, B22F10/25, B22F10/50, B22F10/60, B22F12/00, B22F12/53, B22F12/55, B22F12/70, B22F12/82, B29C64/188, B29C64/205, B29C64/209, B29C64/321, B33Y30/00, B33Y50/02, B33Y70/00
CPC Code(s): B29C64/106
ARKEMA INC. (20240190067). MATTING AGENT RESIN FOR 3D PRINTING simplified abstract
Organization: ARKEMA INC.
Inventor(s): Mary K. CALVIN of King of Prussia PA (US) for ARKEMA INC., Evan J. FISHER of King of Prussia PA (US) for ARKEMA INC., David Shin-Ren LIU of King of Prussia PA (US) for ARKEMA INC., Brian M. CROMER of King of Prussia PA (US) for ARKEMA INC.
IPC Code(s): B29C64/141, B29C64/209, B29C64/336, B29K33/00, B29K433/04, B33Y70/00
CPC Code(s): B29C64/141
Organization: Robert Bosch GmbH
Inventor(s): Hendrik Jahnle of Leutenbach (DE) for Robert Bosch GmbH, Thilo Schneider of Neuhausen (DE) for Robert Bosch GmbH
IPC Code(s): B29C64/209, B29C64/295, B29C64/321, B33Y30/00, B33Y40/00
CPC Code(s): B29C64/209
Organization: JF POLYMERS (SUZHOU) CO., LTD.
Inventor(s): Mingyang HAO of Suzhou (CN) for JF POLYMERS (SUZHOU) CO., LTD., Xiaofan LUO of Suzhou (CN) for JF POLYMERS (SUZHOU) CO., LTD.
IPC Code(s): B29C64/264, B29C64/209, B33Y30/00
CPC Code(s): B29C64/264
Organization: XEROX CORPORATION
Inventor(s): Patrick Y. Maeda of San Jose CA (US) for XEROX CORPORATION, Daniel Bullard of Palo Alto CA (US) for XEROX CORPORATION, Dogan Timucin of Palo Alto CA (US) for XEROX CORPORATION
IPC Code(s): B29C64/273, B29C64/112, B29C64/209, B29C64/245, B29C64/295, B29C64/393
CPC Code(s): B29C64/273
Organization: Hewlett-Packard Development Company, L.P.
Inventor(s): Seongsik CHANG of Palo Alto CA (US) for Hewlett-Packard Development Company, L.P.
IPC Code(s): B29C64/282, B29C64/165, B29C64/236, B29C64/268, B33Y10/00, B33Y30/00
CPC Code(s): B29C64/282
Organization: EOS GmbH Electro Optical Systems
Inventor(s): Julia Schmidt-Petersen of Grafrath (DE) for EOS GmbH Electro Optical Systems
IPC Code(s): B29C64/307, B29C64/153, B29C64/245, B33Y10/00, B33Y30/00, B33Y40/00
CPC Code(s): B29C64/307
Organization: Tritone Technologies Ltd.
Inventor(s): Eli KEDAR of Beit-Dagan (IL) for Tritone Technologies Ltd., Alon FELDMAN of Kibbutz Kfar-Menachem (IL) for Tritone Technologies Ltd., Ofer BEN-ZUR of Hod-HaSharon (IL) for Tritone Technologies Ltd., Rami BEN-MAIMON of Yehud (IL) for Tritone Technologies Ltd.
IPC Code(s): B29C64/35, B08B1/12, B08B1/32, B08B3/02, B08B5/02, B29C64/214, B33Y30/00, B33Y40/00
CPC Code(s): B29C64/35
[[THE BOEING COMPANY (20240190081). METHODS OF ADDITIVELY MANUFACTURING A MANUFACTURED COMPONENT, ADDITIVE MANUFACTURING SYSTEMS THAT PERFORM THE METHODS, AND STORAGE MEDIA THAT DIRECTS ADDITIVE MANUFACTURING SYSTEMS TO PERFORM THE METHODS simplified abstract]]
Organization: THE BOEING COMPANY
Inventor(s): Dana A. Henshaw of Seattle WA (US) for THE BOEING COMPANY, Eric M. Chapman of Bonney Lake WA (US) for THE BOEING COMPANY
IPC Code(s): B29C64/393, B29C64/153, B29C64/321
CPC Code(s): B29C64/393
[[THE BOEING COMPANY (20240190082). METHODS OF ADDITIVELY MANUFACTURING A MANUFACTURED COMPONENT, ADDITIVE MANUFACTURING SYSTEMS THAT PERFORM THE METHODS, AND STORAGE MEDIA THAT DIRECTS ADDITIVE MANUFACTURING SYSTEMS TO PERFORM THE METHODS simplified abstract]]
Organization: THE BOEING COMPANY
Inventor(s): Dana A. Henshaw of Seattle WA (US) for THE BOEING COMPANY, Eric M. Chapman of Bonney Lake WA (US) for THE BOEING COMPANY
IPC Code(s): B29C64/393, B29C64/153, B29C64/321
CPC Code(s): B29C64/393
[[THE BOEING COMPANY (20240190083). METHODS OF ADDITIVELY MANUFACTURING A MANUFACTURED COMPONENT, ADDITIVE MANUFACTURING SYSTEMS THAT PERFORM THE METHODS, AND STORAGE MEDIA THAT DIRECTS ADDITIVE MANUFACTURING SYSTEMS TO PERFORM THE METHODS simplified abstract]]
Organization: THE BOEING COMPANY
Inventor(s): Dana A. Henshaw of Seattle WA (US) for THE BOEING COMPANY, Eric M. Chapman of Bonney Lake WA (US) for THE BOEING COMPANY
IPC Code(s): B29C64/393, B29C64/153, B29C64/321
CPC Code(s): B29C64/393
Organization: HEXA
Inventor(s): Léo BOUFFIER of ANGLET (FR) for HEXA
IPC Code(s): B63B32/59, B29C64/188, B29C64/386, B33Y10/00, B33Y40/20, B33Y50/00, B33Y80/00
CPC Code(s): B63B32/59
Organization: HRL Laboratories, LLC
Inventor(s): Zak C. ECKEL of Thousand Oaks CA (US) for HRL Laboratories, LLC, Andrew P. NOWAK of Los Angeles CA (US) for HRL Laboratories, LLC, Ashley M. DUSTIN of Santa Monica CA (US) for HRL Laboratories, LLC, April R. RODRIGUEZ of Santa Monica CA (US) for HRL Laboratories, LLC, Phuong BUI of Thousand Oaks CA (US) for HRL Laboratories, LLC, Tobias A. SCHAEDLER of Oak Park CA (US) for HRL Laboratories, LLC
IPC Code(s): C04B35/571, B28B1/00, B33Y70/00, B33Y80/00, C08G77/50
CPC Code(s): C04B35/571
Organization: Stratasys, Inc.
Inventor(s): William R. Priedeman, Jr. of Long Lake MN (US) for Stratasys, Inc.
IPC Code(s): C09D11/107, B29C64/118, B29C64/40, B29K33/00, B29K105/00, B33Y10/00, B33Y70/00, C09D11/54
CPC Code(s): C09D11/107
Organization: TOHOKU UNIVERSITY
Inventor(s): Hiroki KURITA of Sendai-shi (JP) for TOHOKU UNIVERSITY, Fumio NARITA of Sendai-shi (JP) for TOHOKU UNIVERSITY, Kenya NAKAJIMA of Sendai-shi (JP) for TOHOKU UNIVERSITY, Masahito WATANABE of Shibata-gun (JP) for TOHOKU UNIVERSITY, Takenobu SATO of Shibata-gun (JP) for TOHOKU UNIVERSITY, Takashi EBATA of Shibata-gun (JP) for TOHOKU UNIVERSITY
IPC Code(s): H10N35/01, B22F10/25, B23K26/342, B23K103/02, B33Y10/00, B33Y70/00, B33Y80/00, H10N35/85
CPC Code(s): H10N35/01
- B22D23/00
- B33Y10/00
- B33Y30/00
- B33Y50/02
- CPC B33Y50/02
- XEROX CORPORATION
- B22F1/05
- B22F1/142
- B22F3/10
- B22F3/105
- B22F9/04
- C22C19/05
- CPC C22C19/05
- Northwestern Polytechnical University
- B22F1/12
- CPC B22F1/12
- Lockheed Martin Corporation
- B22F10/66
- B22F5/00
- B22F10/28
- B22F10/68
- B23P15/02
- B33Y40/20
- B33Y80/00
- CPC B33Y80/00
- SAFRAN AIRCRAFT ENGINES
- B22F10/85
- B22F12/30
- B22F12/50
- B22F12/60
- CPC B22F12/60
- Baker Hughes Oilfield Operations LLC
- B22F10/36
- B22F10/80
- B22F12/41
- B22F12/49
- B22F12/90
- B33Y50/00
- Divergent Technologies, Inc.
- B22F12/20
- B22F10/22
- B22F10/50
- B22F12/70
- B33Y40/00
- INSTITUT DE RECHERCHE TECHNOLOGIQUE JULES VERNE
- B22F12/00
- B29C64/236
- CPC B33Y30/00
- Velo3D, Inc.
- B23K26/06
- B23K26/082
- B23K26/142
- B23K26/244
- B23K26/32
- B23K26/342
- B23K103/00
- CPC B23K103/00
- Illinois Tool Works Inc.
- B28B1/00
- B33Y70/10
- C04B7/02
- C04B7/32
- C04B14/06
- C04B16/02
- C04B16/06
- C04B18/06
- C04B18/08
- C04B22/10
- C04B24/12
- C04B24/26
- C04B28/04
- C04B28/06
- C04B40/00
- CPC C04B40/00
- Hebei Quantum Intelligent Technology Co., Ltd.
- B22F10/20
- B28B1/14
- C04B35/626
- C04B35/636
- CPC C04B35/636
- SOLID LAB SDN BHD
- B28B7/34
- B28B7/28
- B33Y70/00
- THE BOEING COMPANY
- B29C64/106
- B29C64/209
- B29C70/00
- B29K105/00
- C12M1/26
- C12M3/00
- C12M3/06
- C12N5/00
- C12N11/04
- CPC C12N11/04
- ASPECT BIOSYSTEMS LTD.
- B22F10/25
- B22F10/60
- B22F12/53
- B22F12/55
- B22F12/82
- B29C64/188
- B29C64/205
- B29C64/321
- CPC B33Y70/00
- UNIVERSITIES SPACE RESEARCH ASSOCIATION
- B29C64/141
- B29C64/336
- B29K33/00
- B29K433/04
- ARKEMA INC.
- B29C64/295
- CPC B33Y40/00
- Robert Bosch GmbH
- B29C64/264
- JF POLYMERS (SUZHOU) CO., LTD.
- B29C64/273
- B29C64/112
- B29C64/245
- B29C64/393
- CPC B29C64/393
- B29C64/282
- B29C64/165
- B29C64/268
- Hewlett-Packard Development Company, L.P.
- B29C64/307
- B29C64/153
- EOS GmbH Electro Optical Systems
- B29C64/35
- B08B1/12
- B08B1/32
- B08B3/02
- B08B5/02
- B29C64/214
- Tritone Technologies Ltd.
- CPC B29C64/321
- B63B32/59
- B29C64/386
- HEXA
- C04B35/571
- C08G77/50
- CPC C08G77/50
- HRL Laboratories, LLC
- C09D11/107
- B29C64/118
- B29C64/40
- C09D11/54
- CPC C09D11/54
- Stratasys, Inc.
- H10N35/01
- B23K103/02
- H10N35/85
- CPC H10N35/85
- TOHOKU UNIVERSITY
- 3D Printing