3D Printing patent applications on December 19th, 2024
Patent Applications for 3D Printing on December 19th, 2024
Number of patent applications containing '3D Printing' or its variations: 24
Organization: CURIFYLABS OY
Inventor(s): Hossein VAKILI of Turku (FI) for CURIFYLABS OY, Sari AIRAKSINEN of Helsinki (FI) for CURIFYLABS OY
IPC Code(s): A61K9/28, A61K45/06
CPC Code(s): A61K9/2893
The Boeing Company (20240416413). ADDITIVELY MANUFACTURED CHANNELS FOR MOLD DIE CASTINGS
Organization: The Boeing Company
Inventor(s): Michael A. Johnson of Kirkland WA (US) for The Boeing Company, Michael P. Matlack of St. Charles MO (US) for The Boeing Company, Daniel J. Smolinsky of Mill Creek WA (US) for The Boeing Company
IPC Code(s): B22D19/00, B22D25/02, B33Y10/00, B33Y80/00
CPC Code(s): B22D19/0072
Organization: Mitsubishi Electric Corporation
Inventor(s): Daiji MORITA of Tokyo (JP) for Mitsubishi Electric Corporation, Nobuyuki SUMI of Tokyo (JP) for Mitsubishi Electric Corporation, Hisashi YAMADA of Tokyo (JP) for Mitsubishi Electric Corporation
IPC Code(s): B22F10/22, B22F10/36, B22F12/00, B33Y10/00, B33Y30/00, B33Y50/02
CPC Code(s): B22F10/22
Organization: The Boeing Company
Inventor(s): Dale J. Weires of Hockessin DE (US) for The Boeing Company, Jonathan Venezia of Collegeville PA (US) for The Boeing Company, Richard K. Kinmonth of Wenonah NJ (US) for The Boeing Company, Scott M. Holder of Cherry Hill NJ (US) for The Boeing Company
IPC Code(s): B22F10/62, B22F10/22, B22F10/85, B33Y40/20, B33Y50/02, B33Y70/00, B33Y80/00
CPC Code(s): B22F10/62
Hewlett-Packard Development Company, L.P. (20240416423). ADDITIVE MANUFACTURING WITH CONTRAST AGENTS
Organization: Hewlett-Packard Development Company, L.P.
Inventor(s): Clara REMACHA CORBALAN of Sant Cugat del Valles (ES) for Hewlett-Packard Development Company, L.P., Virginia PALACIOS CAMARERO of Sant Cugat del Valles (ES) for Hewlett-Packard Development Company, L.P., Kristopher J. ERICKSON of Palo Alto CA (US) for Hewlett-Packard Development Company, L.P.
IPC Code(s): B22F10/80, B22F10/28, B28B1/00, B29C64/153, B29C64/386, B29K23/00, B29K75/00, B29K77/00, B29K105/00, B29K105/16, B29K505/00, B29K509/00, B29L31/00, B33Y10/00, B33Y50/00, B33Y70/10, B33Y80/00
CPC Code(s): B22F10/80
Organization: Raytheon Technologies Corporation
Inventor(s): Sergei F. Burlatsky of West Hartford CT (US) for Raytheon Technologies Corporation, Andreas Karl Roelofs of West Hartford CT (US) for Raytheon Technologies Corporation, Masoud Anahid of Galena OH (US) for Raytheon Technologies Corporation, Ranadip Acharya of Glastonbury CT (US) for Raytheon Technologies Corporation, Tahany El-Wardany of Vernon CT (US) for Raytheon Technologies Corporation, David U. Furrer of Marlborough CT (US) for Raytheon Technologies Corporation
IPC Code(s): B22F10/85, B22F10/28, B22F12/20, B33Y10/00, B33Y40/20, B33Y50/02
CPC Code(s): B22F10/85
Sodick Co., Ltd. (20240416425). ADDITIVE MANUFACTURING
Organization: Sodick Co., Ltd.
Inventor(s): Itaru MATSUMOTO of Kanagawa (JP) for Sodick Co., Ltd., Tsubasa TAKAYAMA of Kanagawa (JP) for Sodick Co., Ltd.
IPC Code(s): B22F12/41, B22F10/50, B22F10/64, B22F12/20, B33Y10/00, B33Y40/20
CPC Code(s): B22F12/41
Lincoln Global, Inc. (20240416445). DUAL WIRE DRIVE SYSTEM
Organization: Lincoln Global, Inc.
Inventor(s): Jordan Thai of Mentor OH (US) for Lincoln Global, Inc., Alexander C. Mehlman of Strongsville OH (US) for Lincoln Global, Inc.
IPC Code(s): B23K9/133
CPC Code(s): B23K9/1336
Mitsubishi Electric Corporation (20240416455). ADDITIVE MANUFACTURING APPARATUS AND MACHINING HEAD
Organization: Mitsubishi Electric Corporation
Inventor(s): Yuji NOJIRI of Tokyo (JP) for Mitsubishi Electric Corporation, Kazuya HORIO of Tokyo (JP) for Mitsubishi Electric Corporation, Satoshi HATTORI of Tokyo (JP) for Mitsubishi Electric Corporation
IPC Code(s): B23K26/342, B23K26/14, B33Y30/00
CPC Code(s): B23K26/342
Addman Intermediate Holdings, LLC (20240416584). ADDITIVE MANUFACTURING PROCESS
Organization: Addman Intermediate Holdings, LLC
Inventor(s): Mark Saberton of Bonita Springs FL (US) for Addman Intermediate Holdings, LLC
IPC Code(s): B29C64/188, B29C64/112, B29C64/343, B33Y10/00, B33Y40/00
CPC Code(s): B29C64/188
Unknown Organization (20240416585). 3D PRINTER AND RELATED SET OF PARTS
Organization: Unknown Organization
Inventor(s): Joseph ISSA of Montreal (CA) for Unknown Organization
IPC Code(s): B29C64/25, B29C64/232, B29C64/236, B33Y30/00
CPC Code(s): B29C64/25
Organization: Carl Zeiss Vision International GmbH
Inventor(s): Guillaume Gomard of Mannheim (DE) for Carl Zeiss Vision International GmbH, Bernd Borrman of Zoellnitz (DE) for Carl Zeiss Vision International GmbH, Matthias Hillenbrand of Jena (DE) for Carl Zeiss Vision International GmbH, Michael Totzeck of Schwaebisch Gmuend (DE) for Carl Zeiss Vision International GmbH, Roman Zvahelskyi of Karlsruhe (DE) for Carl Zeiss Vision International GmbH, Marc Frederic Mayer of Karlsruhe (DE) for Carl Zeiss Vision International GmbH, Martin Wegener of Karlsruhe (DE) for Carl Zeiss Vision International GmbH
IPC Code(s): B29C64/277, B29C64/135, B29C64/268, B29C64/386, B33Y10/00, B33Y30/00, B33Y50/00
CPC Code(s): B29C64/277
Organization: Chromatic 3D Materials, Inc.
Inventor(s): Cora Leibig of Maple Grove MN (US) for Chromatic 3D Materials, Inc., Michael Garrod of Minnetrista MN (US) for Chromatic 3D Materials, Inc., Daniel Gilbert of Richfield MN (US) for Chromatic 3D Materials, Inc.
IPC Code(s): B29C64/336, B29C64/106, B29C64/118, B29C64/209, B29C64/321, B29C64/393, B29C67/24, B29K75/00, B29K101/10, B29K105/00, B29K105/04, B33Y10/00, B33Y70/10, B33Y80/00
CPC Code(s): B29C64/336
EOS GMBH ELECTRO OPTICAL SYSTEMS (20240416588). FILTER DEVICE
Organization: EOS GMBH ELECTRO OPTICAL SYSTEMS
Inventor(s): Ulrich KLEINHANS of Prittriching (DE) for EOS GMBH ELECTRO OPTICAL SYSTEMS, Philip STRÖBEL of Weidenbach (DE) for EOS GMBH ELECTRO OPTICAL SYSTEMS
IPC Code(s): B29C64/364, B01D39/10, B01D46/54, B01D46/71, B33Y40/00
CPC Code(s): B29C64/364
Organization: Xi’an Jiaotong University
Inventor(s): Qi ZHANG of Xi’an (CN) for Xi’an Jiaotong University, Yin WANG of Xi’an (CN) for Xi’an Jiaotong University, Yukai CHEN of Xi’an (CN) for Xi’an Jiaotong University, Yu LU of Xi’an (CN) for Xi’an Jiaotong University, Junyao WANG of Xi’an (CN) for Xi’an Jiaotong University, Bin HAN of Xi’an (CN) for Xi’an Jiaotong University
IPC Code(s): B29C64/393, B33Y50/02, G06F30/20, G06F113/10
CPC Code(s): B29C64/393
Organization: BOND HIGH PERFORMANCE 3D TECHNOLOGY B.V.
Inventor(s): Jan Teun BARTELDS of Enschede (NL) for BOND HIGH PERFORMANCE 3D TECHNOLOGY B.V., Thomas HJORTNAES of Enschede (NL) for BOND HIGH PERFORMANCE 3D TECHNOLOGY B.V., Jurjen Bate BLAAUW of () for BOND HIGH PERFORMANCE 3D TECHNOLOGY B.V., Sjoerd IDEMA of Enschede (NL) for BOND HIGH PERFORMANCE 3D TECHNOLOGY B.V.
IPC Code(s): B29C64/393, B29C64/118, B29C64/209, B29C64/364, B33Y10/00, B33Y30/00, B33Y50/02
CPC Code(s): B29C64/393
Organization: Solventum Intellectual Properties Company
Inventor(s): Ahmed S. Abuelyaman of Woodbury MN (US) for Solventum Intellectual Properties Company, Zeba Parkar of Marietta GA (US) for Solventum Intellectual Properties Company, John M. Riedesel of San Jose CA (US) for Solventum Intellectual Properties Company
IPC Code(s): C08F299/02, B29C64/135, B29C64/393, B29K71/00, B33Y10/00, B33Y30/00, B33Y50/02, B33Y70/00, C07C69/54, C07C271/22
CPC Code(s): C08F299/024
Organization: Stratasys, Inc.
Inventor(s): Mark Janssen of Geleen (NL) for Stratasys, Inc., Mark Petrus Franciscus Pepels of Geleen (NL) for Stratasys, Inc.
IPC Code(s): C09D167/02, B29C64/153, B29K67/00, B29K71/00, B33Y10/00, B33Y70/00, C09D5/03
CPC Code(s): C09D167/025
Unknown Organization (20240417833). High Speed Steel Composition
Organization: Unknown Organization
Inventor(s): Arthur Craig Reardon of Webster NY (US) for Unknown Organization
IPC Code(s): C22C38/30, B33Y70/00, C22C33/02, C22C38/00, C22C38/02, C22C38/04, C22C38/22, C22C38/24
CPC Code(s): C22C38/30
Organization: Raytheon Technologies Corporation
Inventor(s): Lawrence A. Binek of Glastonbury CT (US) for Raytheon Technologies Corporation, Jose R. Paulino of Jupiter FL (US) for Raytheon Technologies Corporation
IPC Code(s): F04D29/053, F04D29/20
CPC Code(s): F04D29/053
Organization: University of Massachusetts
Inventor(s): Seth W. Donahue of Hadley MA (US) for University of Massachusetts, Aniket Ingrole of Hadley MA (US) for University of Massachusetts, Molly Costa of Hadley MA (US) for University of Massachusetts
IPC Code(s): F16F7/12, B33Y80/00
CPC Code(s): F16F7/121
Organization: NUOVO PIGNONE TECNOLOGIE S.R.L
Inventor(s): Gianni ORSI of Florence (IT) for NUOVO PIGNONE TECNOLOGIE S.R.L, Alberto BABBINI of Florence (IT) for NUOVO PIGNONE TECNOLOGIE S.R.L, Aigbedion AKWARA of Florence (IT) for NUOVO PIGNONE TECNOLOGIE S.R.L, Federico SORGONA' of Florence (IT) for NUOVO PIGNONE TECNOLOGIE S.R.L, Stephen J. WAYMEYER of West Chester OH (US) for NUOVO PIGNONE TECNOLOGIE S.R.L
IPC Code(s): F16J15/16, F16J15/18, F16J15/26
CPC Code(s): F16J15/162
Organization: Fraunhofer-Gesellschaft z. F. d. a. Forschung e.V.
Inventor(s): Klaus HOSCHKE of Freiburg (DE) for Fraunhofer-Gesellschaft z. F. d. a. Forschung e.V., Johannes SOLASS of Freiburg (DE) for Fraunhofer-Gesellschaft z. F. d. a. Forschung e.V.
IPC Code(s): G05B19/4097
CPC Code(s): G05B19/4097
Organization: GM GLOBAL TECHNOLOGY OPERATIONS LLC
Inventor(s): Joseph Hahn of White Lake Township MI (US) for GM GLOBAL TECHNOLOGY OPERATIONS LLC, Patrick J. Eding of Fremont MI (US) for GM GLOBAL TECHNOLOGY OPERATIONS LLC
IPC Code(s): H01M8/04746, B33Y10/00, H01M8/04014, H01M8/04082, H01M8/04089, H01M8/04992
CPC Code(s): H01M8/04753
- A61K9/28
- A61K45/06
- CPC A61K45/06
- CURIFYLABS OY
- B22D19/00
- B22D25/02
- B33Y10/00
- B33Y80/00
- CPC B33Y80/00
- The Boeing Company
- B22F10/22
- B22F10/36
- B22F12/00
- B33Y30/00
- B33Y50/02
- CPC B33Y50/02
- Mitsubishi Electric Corporation
- B22F10/62
- B22F10/85
- B33Y40/20
- B33Y70/00
- B22F10/80
- B22F10/28
- B28B1/00
- B29C64/153
- B29C64/386
- B29K23/00
- B29K75/00
- B29K77/00
- B29K105/00
- B29K105/16
- B29K505/00
- B29K509/00
- B29L31/00
- B33Y50/00
- B33Y70/10
- Hewlett-Packard Development Company, L.P.
- B22F12/20
- Raytheon Technologies Corporation
- B22F12/41
- B22F10/50
- B22F10/64
- CPC B33Y40/20
- Sodick Co., Ltd.
- B23K9/133
- CPC B23K9/133
- Lincoln Global, Inc.
- B23K26/342
- B23K26/14
- CPC B33Y30/00
- B29C64/188
- B29C64/112
- B29C64/343
- B33Y40/00
- CPC B33Y40/00
- Addman Intermediate Holdings, LLC
- B29C64/25
- B29C64/232
- B29C64/236
- Unknown Organization
- B29C64/277
- B29C64/135
- B29C64/268
- CPC B33Y50/00
- Carl Zeiss Vision International GmbH
- B29C64/336
- B29C64/106
- B29C64/118
- B29C64/209
- B29C64/321
- B29C64/393
- B29C67/24
- B29K101/10
- B29K105/04
- Chromatic 3D Materials, Inc.
- B29C64/364
- B01D39/10
- B01D46/54
- B01D46/71
- EOS GMBH ELECTRO OPTICAL SYSTEMS
- G06F30/20
- G06F113/10
- CPC G06F113/10
- Xi’an Jiaotong University
- BOND HIGH PERFORMANCE 3D TECHNOLOGY B.V.
- C08F299/02
- B29K71/00
- C07C69/54
- C07C271/22
- CPC C07C271/22
- Solventum Intellectual Properties Company
- C09D167/02
- B29K67/00
- C09D5/03
- CPC C09D5/03
- Stratasys, Inc.
- C22C38/30
- C22C33/02
- C22C38/00
- C22C38/02
- C22C38/04
- C22C38/22
- C22C38/24
- CPC C22C38/24
- F04D29/053
- F04D29/20
- CPC F04D29/20
- F16F7/12
- University of Massachusetts
- F16J15/16
- F16J15/18
- F16J15/26
- CPC F16J15/26
- NUOVO PIGNONE TECNOLOGIE S.R.L
- G05B19/4097
- CPC G05B19/4097
- Fraunhofer-Gesellschaft z. F. d. a. Forschung e.V.
- H01M8/04746
- H01M8/04014
- H01M8/04082
- H01M8/04089
- H01M8/04992
- CPC H01M8/04992
- GM GLOBAL TECHNOLOGY OPERATIONS LLC
- 3D Printing
