3D Printing patent applications on December 12th, 2024
Patent Applications for 3D Printing on December 12th, 2024
Number of patent applications containing '3D Printing' or its variations: 24
Organization: Kaunas University of Technology
Inventor(s): Daiva Leskauskaite of Kaunas (LT) for Kaunas University of Technology, Rimante Vinauskiene of Kaunas (LT) for Kaunas University of Technology, Viktorija Eisinaite of Kaunas (LT) for Kaunas University of Technology, Ina Jasutiene of Kaunas (LT) for Kaunas University of Technology, Milda Keršiene of Kaunas (LT) for Kaunas University of Technology, Aušra Šipailiene of Kaunas (LT) for Kaunas University of Technology
IPC Code(s): A23L13/60, A23L13/40, A23L33/00, A23L33/115, A23L33/17, A23L33/22, A23P30/20
CPC Code(s): A23L13/67
OSAKA UNIVERSITY (20240408673). Laminate Molding Apparatus and Laminate Molding Method
Organization: OSAKA UNIVERSITY
Inventor(s): Norio YOSHIDA of Suita-shi (JP) for OSAKA UNIVERSITY, Yuji SATO of Suita-shi (JP) for OSAKA UNIVERSITY, Masahiro TSUKAMOTO of Suita-shi (JP) for OSAKA UNIVERSITY, Masahiro IHAMA of Suita-shi (JP) for OSAKA UNIVERSITY, Koji TOJO of Kyoto-shi (JP) for OSAKA UNIVERSITY, Shingo UNO of Kyoto-shi (JP) for OSAKA UNIVERSITY
IPC Code(s): B22F10/322, B22F10/28, B22F12/70, B33Y10/00, B33Y30/00, B33Y50/02
CPC Code(s): B22F10/322
Organization: The Johns Hopkins University
Inventor(s): Steven M. Storck of Catonsville MD (US) for The Johns Hopkins University, Mary E. Daffron of Columbia MD (US) for The Johns Hopkins University, Vincent R. Pagan of Ellicott City MD (US) for The Johns Hopkins University, Brendan P. Croom of Baltimore MD (US) for The Johns Hopkins University, Ari M. Lax of Silver Spring MD (US) for The Johns Hopkins University
IPC Code(s): B22F10/366, B22F10/28, B22F12/41, B33Y30/00, B33Y50/02
CPC Code(s): B22F10/366
Organization: RAYTHEON TECHNOLOGIES CORPORATION
Inventor(s): Jesse R. Boyer of Middletown CT (US) for RAYTHEON TECHNOLOGIES CORPORATION, Brian A. Fisher of West Hartford CT (US) for RAYTHEON TECHNOLOGIES CORPORATION, Alexandru Cadar of Eastford CT (US) for RAYTHEON TECHNOLOGIES CORPORATION, Joshua M. Norman of South Windsor CT (US) for RAYTHEON TECHNOLOGIES CORPORATION
IPC Code(s): B22F10/73, B22F10/28, B22F10/80, B29C64/153, B29C64/357, B29C64/386, B33Y10/00, B33Y40/00, B33Y50/00
CPC Code(s): B22F10/73
Organization: Yamazaki Mazak Corporation
Inventor(s): Seigo OUCHI of Niwa-gun (JP) for Yamazaki Mazak Corporation, Atsushi SUZUKI of Niwa-gun (JP) for Yamazaki Mazak Corporation, Kazuhiro ISHIBASHI of Niwa-gun (JP) for Yamazaki Mazak Corporation
IPC Code(s): B23K9/235, B23K9/04, B23K9/095, B23K37/04, B24D5/12, B33Y10/00, B33Y30/00, B33Y40/10, B33Y50/02
CPC Code(s): B23K9/235
Organization: IPG PHOTONICS CORPORATION
Inventor(s): Christopher M. Galbraith of Ottawa (CA) for IPG PHOTONICS CORPORATION, Jordan A. Kanko of Kingston (CA) for IPG PHOTONICS CORPORATION, Paul J.L. Webster of Kingston (CA) for IPG PHOTONICS CORPORATION
IPC Code(s): B23K26/03, B23K26/06, B23K26/062, B23K26/082, G02B26/10, H01S3/067
CPC Code(s): B23K26/032
Applied Materials, Inc. (20240408712). CERAMIC COOLING BASE
Organization: Applied Materials, Inc.
Inventor(s): Andreas Schmid of Santa Clara CA (US) for Applied Materials, Inc., Stephen Prouty of Santa Clara CA (US) for Applied Materials, Inc., Alvaro Garcia de Gorordo of Santa Clara CA (US) for Applied Materials, Inc., Andrew Antoine Noujaim of Santa Clara CA (US) for Applied Materials, Inc.
IPC Code(s): B23Q11/10, B23Q3/15, F28F13/00, H02N13/00
CPC Code(s): B23Q11/10
SIGNIFY HOLDING B.V. (20240408813). 3D printed material having color and/or reflectivity control
Organization: SIGNIFY HOLDING B.V.
Inventor(s): TIES VAN BOMMEL of HORST (NL) for SIGNIFY HOLDING B.V., RIFAT ATA MUSTAFA HIKMET of EINDHOVEN (NL) for SIGNIFY HOLDING B.V.
IPC Code(s): B29C64/118, B29C64/209, B29L31/00, B33Y10/00, B33Y30/00, B33Y70/10, B33Y80/00, F21V7/04
CPC Code(s): B29C64/118
Thermwood Corporation (20240408814). NEAR NET SHAPE ADDITIVE MANUFACTURING APPARATUS
Organization: Thermwood Corporation
Inventor(s): Kenneth J. SUSNJARA of Birdseye IN (US) for Thermwood Corporation, Brian S. SMIDDY of Newburgh IN (US) for Thermwood Corporation, John FUQUAY of Boonville IN (US) for Thermwood Corporation
IPC Code(s): B29C64/118, B29C64/188, B29C64/209, B29C64/218, B29C64/236, B29C64/245, B29C64/25, B29C64/30, B33Y10/00, B33Y30/00, B33Y40/20
CPC Code(s): B29C64/118
VulcanForms Inc. (20240408818). COMPLIANT RECOATER ASSEMBLIES, SYSTEMS, AND RELATED METHODS
Organization: VulcanForms Inc.
Inventor(s): Lucas Buermeyer of Ayer MA (US) for VulcanForms Inc., William Curtis Stone of Tewksbury MA (US) for VulcanForms Inc., Raghav Aggarwal of Somerville MA (US) for VulcanForms Inc.
IPC Code(s): B29C64/214, B29C64/268
CPC Code(s): B29C64/214
Organization: HON HAI PRECISION INDUSTRY CO., LTD.
Inventor(s): CHING-JU KUO of New Taipei (TW) for HON HAI PRECISION INDUSTRY CO., LTD.
IPC Code(s): B29C64/218, B22F12/63, B22F12/67, B29C64/153, B29C64/214, B29C64/321, B33Y30/00
CPC Code(s): B29C64/218
Winsun technology INC. (20240408820). Architectural 3D printer
Organization: Winsun technology INC.
Inventor(s): Yihe MA of Irvine CA (US) for Winsun technology INC.
IPC Code(s): B29C64/236, B29C64/209, B29C64/232, B29C64/25, B33Y30/00
CPC Code(s): B29C64/236
Organization: General Electric Company
Inventor(s): William Joseph Steele of Lawrenceburg IN (US) for General Electric Company, David Scott Simmermon of Felicity OH (US) for General Electric Company, Brian Thomas Thompson of Loveland OH (US) for General Electric Company
IPC Code(s): B29C64/268, B29C64/236, B33Y10/00, B33Y30/00
CPC Code(s): B29C64/268
NISSAN NORTH AMERICA, INC. (20240408823). 3D PRINTING SYSTEM
Organization: NISSAN NORTH AMERICA, INC.
Inventor(s): Naoki UEDA of Novi MI (US) for NISSAN NORTH AMERICA, INC., Nanzhu ZHAO of Novi MI (US) for NISSAN NORTH AMERICA, INC.
IPC Code(s): B29C64/30, B29C64/245
CPC Code(s): B29C64/30
Organization: BEIJING INSTITUTE OF TECHNOLOGY
Inventor(s): Weidong SONG of Beijing (CN) for BEIJING INSTITUTE OF TECHNOLOGY, Lijun XIAO of Beijing (CN) for BEIJING INSTITUTE OF TECHNOLOGY, Genzhu FENG of Beijing (CN) for BEIJING INSTITUTE OF TECHNOLOGY
IPC Code(s): B29C64/386, B33Y50/00
CPC Code(s): B29C64/386
Organization: Lung Biotechnology PBC
Inventor(s): Akarsh Sivaprasad of Nashua NH (US) for Lung Biotechnology PBC, Shaunak Shilimkan of Valley Center CA (US) for Lung Biotechnology PBC, Daniel E. Backman of Bedford NH (US) for Lung Biotechnology PBC
IPC Code(s): B29C64/393, B29C64/129, B29C64/232, B29C64/255, B29C64/264, B33Y10/00, B33Y30/00, B33Y50/02
CPC Code(s): B29C64/393
VulcanForms Inc. (20240408827). FIBER FUSE DETECTION IN ADDITIVE MANUFACTURING
Organization: VulcanForms Inc.
Inventor(s): Peter Colin Reeves-Hall of Whitinsville MA (US) for VulcanForms Inc., Mark Christopher Mordarski of South Glastonbury CT (US) for VulcanForms Inc.
IPC Code(s): B29C64/393, B29C64/153, B29C64/268, B33Y10/00, B33Y30/00, B33Y50/02
CPC Code(s): B29C64/393
Velo3D, Inc. (20240408828). PRESSURE CONTROL IN MANUFACTURING SYSTEMS
Organization: Velo3D, Inc.
Inventor(s): Sergey Korepanov of Los Altos CA (US) for Velo3D, Inc., Joseph Andrew Tralongo of El Cajon CA (US) for Velo3D, Inc., Alexander Vladimirovich Varlakhanov of San Carlos CA (US) for Velo3D, Inc., Benyamin Buller of Cupertino CA (US) for Velo3D, Inc.
IPC Code(s): B29C64/393, B29C64/371, B33Y10/00, B33Y30/00, B33Y50/02
CPC Code(s): B29C64/393
Organization: General Electric Company
Inventor(s): William C. Alberts of Saratoga Springs NY (US) for General Electric Company, Vadim Bromberg of Niskayuna NY (US) for General Electric Company, Kwok Pong Chan of Niskayuna NY (US) for General Electric Company, Robert Edgar Estes of Anderson Township OH (US) for General Electric Company, Jacob Mayer of Cincinnati OH (US) for General Electric Company, Joshua Tyler Mook of Cincinnati OH (US) for General Electric Company, Janet Mekker of Loveland OH (US) for General Electric Company, William Cosmo Murphy of Springboro OH (US) for General Electric Company, Arunkumar Natarajan of Mason OH (US) for General Electric Company, Mary Kathryn Thompson of Fairfield Township OH (US) for General Electric Company, Xi Yang of Mason OH (US) for General Electric Company, Travis Sands of Lebanon OH (US) for General Electric Company
IPC Code(s): B41J2/165, B22F10/14, B22F10/38, B22F10/70, B22F12/90, C09D9/00, C09D11/107, C09D11/30
CPC Code(s): B41J2/16552
Inkbit, LLC (20240409691). VINYL SULFONYL AGENTS FOR THIOL-ENE POLYMERIZATION AND RELATED USES
Organization: Inkbit, LLC
Inventor(s): Scott TWIDDY of Somerville MA (US) for Inkbit, LLC
IPC Code(s): C08G75/30, C08K13/02
CPC Code(s): C08G75/30
Organization: Tsinghua University
Inventor(s): Hao ZHANG of Beijing City (CN) for Tsinghua University, Jinghong LI of Beijing City (CN) for Tsinghua University, Hongbo SUN of Beijing City (CN) for Tsinghua University, Linhan LIN of Beijing City (CN) for Tsinghua University, Fu LI of Beijing City (CN) for Tsinghua University, Shaofeng LIU of Beijing City (CN) for Tsinghua University, Wangyu LIU of Beijing City (CN) for Tsinghua University, Zhengwei HOU of Beijing City (CN) for Tsinghua University
IPC Code(s): C30B29/16, B33Y10/00, B33Y70/00, B33Y80/00, B82Y40/00
CPC Code(s): C30B29/16
Organization: Unknown Organization
Inventor(s): Hyun Ki KANG of Busan (KR) for Unknown Organization, Sam Sub BYUN of Busan (KR) for Unknown Organization, Jong Yeob LEE of Busan (KR) for Unknown Organization, Jae Wha SON of Busan (KR) for Unknown Organization, Taek Ho CHUNG of Busan (KR) for Unknown Organization
IPC Code(s): F01D11/08, B23K9/04
CPC Code(s): F01D11/08
Applied Materials, Inc. (20240410773). Integrated Pressure Sensor for Process Chamber Assemblies
Organization: Applied Materials, Inc.
Inventor(s): Chih-Yang CHANG of Santa Clara CA (US) for Applied Materials, Inc., Shantanu Rajiv GADGIL of Santa Clara CA (US) for Applied Materials, Inc., Chien-Min LIAO of San Jose CA (US) for Applied Materials, Inc., Shannon WANG of Santa Clara CA (US) for Applied Materials, Inc., Yao-Hung YANG of Santa Clara CA (US) for Applied Materials, Inc., Tom K. CHO of Los Altos CA (US) for Applied Materials, Inc.
IPC Code(s): G01L13/06, C23C16/455, C23C16/52, G01M13/005
CPC Code(s): G01L13/06
Organization: Nippon Telegraph and Telephone Corporation
Inventor(s): Tomoki Murakami of Musashino-shi, Tokyo (JP) for Nippon Telegraph and Telephone Corporation, Ryotaro TANIGUCHI of Musashino-shi, Tokyo (JP) for Nippon Telegraph and Telephone Corporation, Tomoaki Ogawa of Musashino-shi, Tokyo (JP) for Nippon Telegraph and Telephone Corporation, Yasushi TAKATORI of Musashino-shi, Tokyo (JP) for Nippon Telegraph and Telephone Corporation
IPC Code(s): H04B17/391
CPC Code(s): H04B17/3913
- A23L13/60
- A23L13/40
- A23L33/00
- A23L33/115
- A23L33/17
- A23L33/22
- A23P30/20
- CPC A23P30/20
- Kaunas University of Technology
- B22F10/322
- B22F10/28
- B22F12/70
- B33Y10/00
- B33Y30/00
- B33Y50/02
- CPC B33Y50/02
- OSAKA UNIVERSITY
- B22F10/366
- B22F12/41
- The Johns Hopkins University
- B22F10/73
- B22F10/80
- B29C64/153
- B29C64/357
- B29C64/386
- B33Y40/00
- B33Y50/00
- CPC B33Y50/00
- RAYTHEON TECHNOLOGIES CORPORATION
- B23K9/235
- B23K9/04
- B23K9/095
- B23K37/04
- B24D5/12
- B33Y40/10
- Yamazaki Mazak Corporation
- B23K26/03
- B23K26/06
- B23K26/062
- B23K26/082
- G02B26/10
- H01S3/067
- CPC H01S3/067
- IPG PHOTONICS CORPORATION
- B23Q11/10
- B23Q3/15
- F28F13/00
- H02N13/00
- CPC H02N13/00
- Applied Materials, Inc.
- B29C64/118
- B29C64/209
- B29L31/00
- B33Y70/10
- B33Y80/00
- F21V7/04
- CPC F21V7/04
- SIGNIFY HOLDING B.V.
- B29C64/188
- B29C64/218
- B29C64/236
- B29C64/245
- B29C64/25
- B29C64/30
- B33Y40/20
- CPC B33Y40/20
- Thermwood Corporation
- B29C64/214
- B29C64/268
- CPC B29C64/268
- VulcanForms Inc.
- B22F12/63
- B22F12/67
- B29C64/321
- CPC B33Y30/00
- HON HAI PRECISION INDUSTRY CO., LTD.
- B29C64/232
- Winsun technology INC.
- General Electric Company
- CPC B29C64/245
- NISSAN NORTH AMERICA, INC.
- BEIJING INSTITUTE OF TECHNOLOGY
- B29C64/393
- B29C64/129
- B29C64/255
- B29C64/264
- Lung Biotechnology PBC
- B29C64/371
- Velo3D, Inc.
- B41J2/165
- B22F10/14
- B22F10/38
- B22F10/70
- B22F12/90
- C09D9/00
- C09D11/107
- C09D11/30
- CPC C09D11/30
- C08G75/30
- C08K13/02
- CPC C08K13/02
- Inkbit, LLC
- C30B29/16
- B33Y70/00
- B82Y40/00
- CPC B82Y40/00
- Tsinghua University
- F01D11/08
- CPC B23K9/04
- Unknown Organization
- G01L13/06
- C23C16/455
- C23C16/52
- G01M13/005
- CPC G01M13/005
- H04B17/391
- CPC H04B17/391
- Nippon Telegraph and Telephone Corporation
- 3D Printing