18754753. HEAT DISPERSION LAYERS FOR DOUBLE SIDED INTERCONNECT simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
Contents
HEAT DISPERSION LAYERS FOR DOUBLE SIDED INTERCONNECT
Organization Name
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Inventor(s)
Hsin-Yen Huang of New Taipei City (TW)
Shao-Kuan Lee of Kaohsiung City (TW)
Hsiao-Kang Chang of Hsinchu City (TW)
Cherng-Shiaw Tsai of New Taipei City (TW)
HEAT DISPERSION LAYERS FOR DOUBLE SIDED INTERCONNECT - A simplified explanation of the abstract
This abstract first appeared for US patent application 18754753 titled 'HEAT DISPERSION LAYERS FOR DOUBLE SIDED INTERCONNECT
The abstract of this patent application describes an integrated chip with multiple layers designed to disperse heat efficiently.
- The chip includes a device layer with a first surface and a second surface.
- A first thermal dispersion layer is above the device layer, while a second thermal dispersion layer is below it.
- The first thermal conductivity of the first thermal dispersion layer differs from the second thermal conductivity of the second thermal dispersion layer.
Potential Applications: - This technology could be used in electronic devices such as smartphones, laptops, and tablets to improve thermal management and prevent overheating. - It may also find applications in industrial settings where heat dissipation is crucial for the performance and longevity of electronic components.
Problems Solved: - Addresses the issue of heat buildup in electronic devices, which can lead to reduced performance and potential damage to components. - Provides a solution for improving thermal efficiency and prolonging the lifespan of electronic devices.
Benefits: - Enhanced thermal management capabilities leading to improved overall performance of electronic devices. - Increased reliability and durability of electronic components due to better heat dissipation.
Commercial Applications: - This technology could be valuable for electronics manufacturers looking to enhance the performance and longevity of their products. - It may also be of interest to companies in the industrial sector seeking efficient thermal management solutions for electronic systems.
Questions about the Technology: 1. How does the integration of multiple thermal dispersion layers improve heat dissipation in electronic devices? 2. What specific factors determine the thermal conductivity of each dispersion layer in the integrated chip?
Original Abstract Submitted
Various embodiments of the present disclosure are directed towards an integrated chip including a device layer including a first surface opposite a second surface. A first thermal dispersion layer overlies the device layer. A second thermal dispersion layer underlies the device layer. A first thermal conductivity of the first thermal dispersion layer is different from a second thermal conductivity of the second thermal dispersion layer.
