18754434. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Myungsam Kang of Hwaseong-si (KR)
Jeongseok Kim of Cheonan-si (KR)
Bongju Cho of Hwaseong-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18754434 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the abstract includes a first redistribution structure with embedded pads and a vertical connection structure with a land layer and a pillar layer.
- The first redistribution structure has a first surface with a first pad and a second pad embedded, along with a first redistribution layer.
- The vertical connection structure includes a land layer embedded in the first surface of the first redistribution structure, with the upper surface of the land layer narrower than the lower surface of the pillar layer.
Potential Applications: - This technology could be used in the manufacturing of advanced semiconductor packages for various electronic devices. - It may find applications in the development of high-performance computing systems and mobile devices.
Problems Solved: - Enhances the efficiency and performance of semiconductor packages. - Provides a reliable vertical connection structure for improved connectivity.
Benefits: - Improved signal transmission and reduced signal loss. - Enhanced overall functionality and reliability of semiconductor packages.
Commercial Applications: - This technology could be valuable in the semiconductor industry for the production of cutting-edge electronic devices. - It may have implications for the development of next-generation computing systems.
Questions about the technology: 1. How does the vertical connection structure improve the performance of semiconductor packages? 2. What are the potential challenges in implementing this technology in mass production?
Frequently Updated Research: - Stay updated on the latest advancements in semiconductor packaging technology to leverage the benefits of this innovation.
Original Abstract Submitted
A semiconductor package includes a first redistribution structure having a first surface in which a first pad and a second pad are embedded and including a first redistribution layer thereon, and a vertical connection structure including a land layer and a pillar layer. The land layer is embedded in the first surface of the first redistribution structure, and a width of an upper surface of the land layer is narrower than a width of a lower surface of the pillar layer.
