18753192. SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND ARTICLE MANUFACTURING METHOD simplified abstract (CANON KABUSHIKI KAISHA)
Contents
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND ARTICLE MANUFACTURING METHOD
Organization Name
Inventor(s)
KEN-ICHIRO Shinoda of Tochigi (JP)
OSAMU Yasunobe of Tochigi (JP)
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND ARTICLE MANUFACTURING METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18753192 titled 'SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND ARTICLE MANUFACTURING METHOD
Simplified Explanation: The patent application describes a substrate processing apparatus that can radiate light on a composition with an optimal amount of radiation based on acquired spectral sensitivity characteristics.
- The apparatus performs pattern formation processing on a composition on a substrate.
- It includes a radiation unit to radiate light onto the substrate, a dispenser to apply the composition, a template holding unit, and a controller to adjust the radiation amount based on spectral sensitivity characteristics.
Key Features and Innovation:
- Substrate processing apparatus for pattern formation processing.
- Radiates light with optimal amount based on spectral sensitivity characteristics.
- Dispenser applies composition, template holding unit for contact with composition.
- Controller adjusts radiation amount based on measured spectral sensitivity characteristics.
Potential Applications: The technology can be used in semiconductor manufacturing, photolithography, and other industries requiring precise pattern formation on substrates.
Problems Solved:
- Ensures optimal radiation amount for composition based on spectral sensitivity.
- Improves accuracy and efficiency of pattern formation processing.
Benefits:
- Enhanced precision in pattern formation.
- Increased efficiency in substrate processing.
- Reduction in material waste.
Commercial Applications: The technology has potential applications in semiconductor fabrication, display manufacturing, and microelectronics industries, offering improved accuracy and efficiency in pattern formation processes.
Questions about Substrate Processing Apparatus: 1. How does the apparatus determine the optimal radiation amount based on spectral sensitivity characteristics? 2. What are the specific industries that can benefit the most from this technology?
Frequently Updated Research: Ongoing research may focus on enhancing the spectral sensitivity measurement techniques to further optimize the radiation amount for different compositions and substrates.
Original Abstract Submitted
A substrate processing apparatus that can radiate light on a composition in an optimum radiation amount based on acquired spectral sensitivity characteristics can be provided. A substrate processing apparatus configured to perform pattern formation processing on a composition on a substrate includes a first radiation unit configured to radiate first light onto the substrate, a dispenser configured to apply the composition to a first position inside the substrate processing apparatus, a template holding unit configured to hold a template to be brought in contact with the composition on the substrate, and a controller configured to control a radiation amount of the first light to be radiated by the first radiation unit based on spectral sensitivity characteristics of the composition that are measured in advance.
