18751626. RADIO FREQUENCY MODULE, MANUFACTURING METHOD OF RADIO FREQUENCY MODULE, AND COMMUNICATION DEVICE simplified abstract (Murata Manufacturing Co., Ltd.)
Contents
- 1 RADIO FREQUENCY MODULE, MANUFACTURING METHOD OF RADIO FREQUENCY MODULE, AND COMMUNICATION DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 RADIO FREQUENCY MODULE, MANUFACTURING METHOD OF RADIO FREQUENCY MODULE, AND COMMUNICATION DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Key Features and Innovation
- 1.6 Potential Applications
- 1.7 Problems Solved
- 1.8 Benefits
- 1.9 Commercial Applications
- 1.10 Prior Art
- 1.11 Frequently Updated Research
- 1.12 Questions about Radio Frequency Module Technology
- 1.13 Original Abstract Submitted
RADIO FREQUENCY MODULE, MANUFACTURING METHOD OF RADIO FREQUENCY MODULE, AND COMMUNICATION DEVICE
Organization Name
Murata Manufacturing Co., Ltd.
Inventor(s)
Mayuka Ono of Nagaokakyo-shi (JP)
Motoji Tsuda of Nagaokakyo-shi (JP)
RADIO FREQUENCY MODULE, MANUFACTURING METHOD OF RADIO FREQUENCY MODULE, AND COMMUNICATION DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18751626 titled 'RADIO FREQUENCY MODULE, MANUFACTURING METHOD OF RADIO FREQUENCY MODULE, AND COMMUNICATION DEVICE
Simplified Explanation
The patent application describes a radio frequency module with improved heat dissipation and shielding properties. The module includes an electronic component covered with a resin layer and a metal electrode layer, enhancing its performance.
- The electronic component has a main surface covered with a metal electrode layer and a resin layer on the opposite side.
- The resin layer covers the outer peripheral surface of the electronic component, providing heat dissipation properties.
- The metal electrode layer enhances shielding properties and covers the main surface of the electronic component.
- The electronic component has an inclined surface and is strategically positioned on the mounting board for optimal functionality.
Key Features and Innovation
- Improved heat dissipation properties in a radio frequency module.
- Enhanced shielding properties with a metal electrode layer.
- Strategic positioning of the electronic component for optimal performance.
- Resin layer covering the outer peripheral surface for heat management.
Potential Applications
The technology can be applied in various radio frequency modules, communication devices, and electronic systems requiring efficient heat dissipation and shielding properties.
Problems Solved
The technology addresses the challenges of heat dissipation and electromagnetic interference in radio frequency modules, ensuring better performance and reliability.
Benefits
- Improved heat dissipation capabilities.
- Enhanced shielding properties.
- Increased performance and reliability of electronic components.
Commercial Applications
- The technology can be utilized in telecommunications equipment.
- It can be integrated into consumer electronics for better performance.
- Suitable for industrial applications requiring reliable radio frequency modules.
Prior Art
Readers can explore prior patents related to heat dissipation and shielding in electronic components to understand the evolution of similar technologies.
Frequently Updated Research
Stay updated on advancements in heat dissipation materials and techniques for electronic components to enhance the performance of radio frequency modules.
Questions about Radio Frequency Module Technology
What are the key benefits of using a resin layer in electronic components for heat dissipation?
The resin layer helps in managing heat effectively, preventing overheating and ensuring optimal performance of the electronic component.
How does the metal electrode layer contribute to shielding properties in a radio frequency module?
The metal electrode layer acts as a shield, blocking electromagnetic interference and enhancing the overall performance of the module.
Original Abstract Submitted
A radio frequency module that can improve heat dissipation properties and shielding properties is provided. In a radio frequency module, an electronic component has a main surface on an opposite side of a mounting board side and an outer peripheral surface. A resin layer covers at least a part of the outer peripheral surface of the electronic component. A metal electrode layer covers the main surface of the electronic component and a main surface of the resin layer on the opposite side of the mounting board side. In plan view from a thickness direction of a mounting board, an outer edge of the main surface of the electronic component is located on an inner side of an outer edge of the electronic component. The electronic component further has an inclined surface.
