18750258. SEMICONDUCTOR DEVICE simplified abstract (Murata Manufacturing Co., Ltd.)

SEMICONDUCTOR DEVICE

Organization Name

Murata Manufacturing Co., Ltd.

Inventor(s)

Mari Saji of Nagaokakyo-shi (JP)

Atsushi Kurokawa of Nagaokakyo-shi (JP)

Masahiro Shibata of Nagaokakyo-shi (JP)

SEMICONDUCTOR DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18750258 titled 'SEMICONDUCTOR DEVICE

The semiconductor device described in the abstract includes a semiconductor substrate, at least one transistor with semiconductor layers, wiring on the transistor, insulating films with openings, redistribution layers, and bumps for electrical connections.

• The device features a complex structure with multiple layers and components.
• The wiring is electrically connected to the redistribution layer via openings in the insulating films.
• The bumps provide additional electrical connections to the redistribution layer.
• The design allows for efficient electrical routing and connectivity within the semiconductor device.
• The technology enables compact and high-performance semiconductor devices.

Potential Applications: - Integrated circuits - Microprocessors - Memory chips

Problems Solved: - Efficient electrical routing in semiconductor devices - Improved connectivity between components - Compact design for space-saving applications

Benefits: - Enhanced performance of semiconductor devices - Increased reliability of electrical connections - Compact and efficient design for various applications

Commercial Applications: Title: Advanced Semiconductor Devices for High-Performance Electronics This technology can be utilized in the production of advanced integrated circuits, microprocessors, and memory chips for various electronic devices. The compact design and efficient electrical routing make it ideal for high-performance applications in the electronics industry.

Prior Art: Readers can explore prior patents related to semiconductor device structures, wiring layouts, and electrical connectivity in similar technologies to gain a deeper understanding of the advancements presented in this patent application.

Frequently Updated Research: Researchers in the field of semiconductor devices and electronics may conduct studies on improving the efficiency and performance of complex semiconductor structures, wiring configurations, and electrical connections to enhance the overall functionality of electronic devices.

Questions about Semiconductor Devices: 1. How does the design of this semiconductor device contribute to improved performance in electronic applications? 2. What are the key factors to consider when optimizing the electrical routing and connectivity in semiconductor devices?

Original Abstract Submitted

A semiconductor device includes a semiconductor substrate, at least one transistor on the semiconductor substrate and including semiconductor layers, a wiring on the transistor, a first insulating film including a first opening in a region overlapping the transistor and the wiring in plan view in a first direction perpendicular to the semiconductor substrate, a first redistribution layer on the first insulating film, overlapping the at least one transistor in the first direction in plan view, and electrically connected to the wiring via the first opening, a second insulating film covering the first redistribution layer and the first insulating film and provided with a second opening in a region overlapping at least a part of the first redistribution layer in the first direction in plan view, and a bump electrically connected to the first redistribution layer via the second opening.