18747961. SEMICONDUCTOR DEVICE, PHOTOELECTRIC CONVERSION SYSTEM, MOVABLE OBJECT simplified abstract (CANON KABUSHIKI KAISHA)
Contents
SEMICONDUCTOR DEVICE, PHOTOELECTRIC CONVERSION SYSTEM, MOVABLE OBJECT
Organization Name
Inventor(s)
NOBUAKI Kakinuma of Tokyo (JP)
SEMICONDUCTOR DEVICE, PHOTOELECTRIC CONVERSION SYSTEM, MOVABLE OBJECT - A simplified explanation of the abstract
This abstract first appeared for US patent application 18747961 titled 'SEMICONDUCTOR DEVICE, PHOTOELECTRIC CONVERSION SYSTEM, MOVABLE OBJECT
Simplified Explanation:
This patent application describes a semiconductor device with two semiconductor substrates, each having its own power supply voltage and protection circuit.
Key Features and Innovation:
- Two semiconductor substrates with individual power supplies
- Separate protection circuits for each substrate
- Higher power supply voltage for the first substrate
- External input for power supply voltages
Potential Applications:
This technology could be used in various electronic devices that require different power supply voltages for different elements on the semiconductor substrates.
Problems Solved:
This technology addresses the need for separate power supplies and protection circuits for different semiconductor substrates in a single device.
Benefits:
The benefits of this technology include improved efficiency, reliability, and performance of semiconductor devices with multiple substrates.
Commercial Applications:
This technology could have commercial applications in the semiconductor industry for the development of advanced electronic devices with enhanced functionality and reliability.
Questions about Semiconductor Devices: 1. What are the main advantages of using separate power supplies for different semiconductor substrates in a device? 2. How does the use of individual protection circuits for each substrate improve the overall performance of the semiconductor device?
Original Abstract Submitted
A semiconductor device includes a first semiconductor substrate, a second semiconductor substrate stacked on the first semiconductor substrate, a first pad to which a first power supply voltage for driving an element on the first semiconductor substrate is externally input, a second pad to which a second power supply voltage for driving an element on the second semiconductor substrate is externally input, a first protection circuit disposed on the first semiconductor substrate, and a second protection circuit disposed on the second semiconductor substrate, wherein the first power supply voltage is higher than the second power supply voltage, wherein the first protection circuit is electrically connected to the first pad, and wherein the second protection circuit is electrically connected to the second pad.
