18745045. Heatsink techniques for optical and electrical modules simplified abstract (Ciena Corporation)
Contents
Heatsink techniques for optical and electrical modules
Organization Name
Inventor(s)
Mitchell O'leary of Ottawa (CA)
Trevor Meunier of Kemptville (CA)
Terence Graham of Manotick (CA)
Heatsink techniques for optical and electrical modules - A simplified explanation of the abstract
This abstract first appeared for US patent application 18745045 titled 'Heatsink techniques for optical and electrical modules
The abstract describes a module for use in a hardware platform for networking, computing, and/or storage, which includes a printed circuit board assembly with components on a primary side, a primary side heatsink for a pluggable module, and a cage for supporting the pluggable module.
- The module includes a primary side heatsink that applies a uniform and controlled external force against the pluggable module.
- A cage is attached to the printed circuit board assembly to support the pluggable module.
- The primary side heatsink is disposed to one or more pivot points on the pluggable module for optimal force application.
- The pivot points are external to the cage, enhancing the structural support of the pluggable module.
Potential Applications: - Data centers - Networking equipment - High-performance computing systems
Problems Solved: - Ensures proper cooling and support for pluggable modules - Enhances the reliability and longevity of hardware platforms
Benefits: - Improved thermal management - Increased system stability - Extended hardware lifespan
Commercial Applications: Title: Enhanced Cooling and Support Module for Hardware Platforms This technology can be utilized in data centers, networking equipment, and high-performance computing systems to optimize thermal management and enhance hardware reliability. The market implications include improved system performance, reduced downtime, and increased overall efficiency.
Prior Art: Researchers can explore prior patents related to heatsink designs, pluggable module support structures, and thermal management solutions in hardware platforms to gain insights into existing technologies in this field.
Frequently Updated Research: Researchers in the field of hardware design and thermal management may be conducting studies on advanced heatsink materials, innovative cooling techniques, and optimized support structures for pluggable modules. Stay updated on the latest research to leverage cutting-edge technologies in hardware platform development.
Questions about the technology: 1. How does the primary side heatsink improve the performance of pluggable modules? 2. What are the key advantages of using a cage for supporting pluggable modules?
Original Abstract Submitted
A module for use in a hardware platform for networking, computing, and/or storage includes a printed circuit board assembly; components disposed on a primary side of the printed circuit board assembly; a primary side heatsink for a pluggable module, wherein the primary side heatsink is disposed to one or more pivot points on the pluggable module, for applying a uniform and controlled external force against the pluggable module. The module further includes a cage attached to the printed circuit board assembly for supporting the pluggable module, wherein the one or more pivot points are external to the cage.
