18743005. THICK FILM-FORMING COMPOSITION AND METHOD FOR MANUFACTURING CURED FILM USING THE SAME simplified abstract (Merck Patent GmbH)
Contents
THICK FILM-FORMING COMPOSITION AND METHOD FOR MANUFACTURING CURED FILM USING THE SAME
Organization Name
Inventor(s)
YOSHIO Nojima of SHIZUOKA (JP)
TAKASHI Sekito of SHIZUOKA (JP)
HIROSHI Hitokawa of SHIZUOKA (JP)
TAKANORI Kudo of BEDMINSTER NH (US)
THICK FILM-FORMING COMPOSITION AND METHOD FOR MANUFACTURING CURED FILM USING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18743005 titled 'THICK FILM-FORMING COMPOSITION AND METHOD FOR MANUFACTURING CURED FILM USING THE SAME
The abstract describes a thick film-forming composition containing a hydrocarbon-containing compound and a solvent. The film formed from this composition has a thickness of 0.5 to 10 μm.
- The composition includes a hydrocarbon-containing compound (A) and a solvent (B).
- The solvent may be an organic solvent (B1) with a dielectric constant of 20.0 to 90.0.
- The film thickness of the film formed from the composition ranges from 0.5 to 10 μm.
Potential Applications: - Coating applications in various industries such as electronics, automotive, and aerospace. - Protective coatings for surfaces requiring a specific film thickness.
Problems Solved: - Provides a solution for creating films with a controlled thickness range. - Offers a versatile composition for different coating needs.
Benefits: - Allows for precise control over film thickness. - Enhances the durability and performance of coated surfaces.
Commercial Applications: - Potential commercial uses include manufacturing of electronic components, automotive parts, and aircraft components. - Market implications include increased efficiency in coating processes and improved product quality.
Questions about the technology: 1. How does the dielectric constant of the solvent impact the film-forming process?
The dielectric constant of the solvent affects the film's properties and performance, such as adhesion and durability.
2. What are the advantages of using a hydrocarbon-containing compound in the film-forming composition?
Hydrocarbon-containing compounds offer excellent film-forming properties and compatibility with various substrates.
Original Abstract Submitted
A thick film-forming composition comprising a hydrocarbon-containing compound (A) as defined herein and a solvent (B). The solvent (B) may be an organic solvent (B1) and may have a dielectric constant of 20.0 to 90.0. The film thickness of the film formed from the thick film-forming composition is 0.5 to 10 μm.
