18706307. MOUNTING STRUCTURE (NIPPON TELEGRAPH AND TELEPHONE CORPORATION)
Contents
MOUNTING STRUCTURE
Organization Name
NIPPON TELEGRAPH AND TELEPHONE CORPORATION
Inventor(s)
MOUNTING STRUCTURE
This abstract first appeared for US patent application 18706307 titled 'MOUNTING STRUCTURE
Original Abstract Submitted
An embodiment is a mounting structure including a high-frequency package and a mounting substrate on which the high-frequency package is mounted. In an area of a portion where a first signal lead pin and a second signal lead pin are in contact with the package housing on the bottom surface side, a recess is provided in the package housing. The recess toward the inside of the package housing up to a portion before the connection portion between the signal lead pins and the package conductor layer in the arrangement region of the signal lead pins on the side face of the package housing on the tip side of the signal lead pins.
