18685137. ELECTRONIC ASSEMBLY HAVING A POWER SEMICONDUCTOR COMPONENT BETWEEN TWO CIRCUIT CARRIERS, AND METHOD FOR PRODUCING SAME simplified abstract (Robert Bosch GmbH)
ELECTRONIC ASSEMBLY HAVING A POWER SEMICONDUCTOR COMPONENT BETWEEN TWO CIRCUIT CARRIERS, AND METHOD FOR PRODUCING SAME
Organization Name
Inventor(s)
Arne Stephen Fischer of Leifikden-Echterdingen (DE)
Hartmut Wayand of Pfullingen (DE)
Johannes Meckbach of Tuebingen (DE)
Lukas Loeber of Ludwigsburg (DE)
Thomas Kiedrowski of Sersheim (DE)
ELECTRONIC ASSEMBLY HAVING A POWER SEMICONDUCTOR COMPONENT BETWEEN TWO CIRCUIT CARRIERS, AND METHOD FOR PRODUCING SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18685137 titled 'ELECTRONIC ASSEMBLY HAVING A POWER SEMICONDUCTOR COMPONENT BETWEEN TWO CIRCUIT CARRIERS, AND METHOD FOR PRODUCING SAME
Simplified Explanation: The patent application describes an electronic assembly with a power semiconductor component and a circuit carrier. The power semiconductor component is connected to the circuit carrier using a connecting layer with a solder connection.
- The power semiconductor component has contact regions on opposite sides.
- The contact region facing the circuit carrier is in electrical contact with a connection region on the circuit carrier.
- The power semiconductor component is also in electrical contact with a further circuit carrier on the side facing away from the first circuit carrier.
- A connecting layer is additively generated on the contact region and/or the connection region of the circuit carriers.
- The connecting layer is connected to the connection region and/or the contact region using a solder connection.
- The connecting layer has a lower modulus of elasticity in a direction perpendicular to the surface of the power semiconductor component compared to a direction parallel to the surface.
Potential Applications: 1. Power electronics 2. Automotive industry 3. Renewable energy systems
Problems Solved: 1. Improved electrical connections in electronic assemblies 2. Enhanced reliability and durability of power semiconductor components
Benefits: 1. Increased efficiency in power electronics 2. Enhanced performance of electronic assemblies 3. Extended lifespan of power semiconductor components
Commercial Applications: The technology can be utilized in the manufacturing of power electronic devices for various industries such as automotive, renewable energy, and industrial applications. It can improve the reliability and performance of electronic systems, leading to cost savings and increased competitiveness in the market.
Prior Art: Prior research in the field of power electronics and electronic assembly techniques may provide insights into similar methods of connecting power semiconductor components to circuit carriers.
Frequently Updated Research: Researchers are continuously exploring new materials and techniques to improve the performance and reliability of power semiconductor components in electronic assemblies.
Questions about Electronic Assembly Technology: 1. How does the lower modulus of elasticity in the connecting layer contribute to the overall performance of the electronic assembly? 2. What are the specific challenges in implementing this technology in high-power applications?
Original Abstract Submitted
An electronic assembly having a power semiconductor component and a circuit carrier. The power semiconductor component has a contact region on opposite sides; the contact region facing the circuit carrier is in electrical contact with a connection region of the circuit carrier; the power semiconductor component is in electrical contact on the side facing away from the circuit carrier, in the region of the contact region, with a further circuit carrier; an additively generated connecting layer is arranged on the contact region and/or the connection region of the circuit carriers; and the connecting layer is connected to the connection region and/or the contact region using a solder connection. The connecting layer has a lower modulus of elasticity in a direction or plane extending perpendicularly to the surface of the power semiconductor component than in a direction or plane extending in parallel with the surface of the power semiconductor component.
