18683049. PHASE CHANGE HEATSINK, MANUFACTURING PROCESS THEREOF, AND COMMUNICATION DEVICE HAVING THE HEATSINK simplified abstract (Telefonaktiebolaget LM Ericsson (publ))
Contents
PHASE CHANGE HEATSINK, MANUFACTURING PROCESS THEREOF, AND COMMUNICATION DEVICE HAVING THE HEATSINK
Organization Name
Telefonaktiebolaget LM Ericsson (publ)
Inventor(s)
PHASE CHANGE HEATSINK, MANUFACTURING PROCESS THEREOF, AND COMMUNICATION DEVICE HAVING THE HEATSINK - A simplified explanation of the abstract
This abstract first appeared for US patent application 18683049 titled 'PHASE CHANGE HEATSINK, MANUFACTURING PROCESS THEREOF, AND COMMUNICATION DEVICE HAVING THE HEATSINK
The abstract describes a phase change heatsink with a heatsink base and a phase change heat spreader integrated into the base. The heat spreader includes a cover attached to the base, enclosing a cavity partially filled with refrigerant. The manufacturing process involves die-casting the base, attaching the cover, and filling the cavity with refrigerant.
- Heatsink base with integrated phase change heat spreader
- Cover attached to the base enclosing a cavity filled with refrigerant
- Support pillars extending from the base to the cover
- Manufacturing process involving die-casting, attaching the cover, and filling the cavity with refrigerant
- Sealing the periphery of the cover and bonding the central portion to the support pillars
Potential Applications: - Cooling systems for electronic devices - Thermal management in communication devices - Heat dissipation in high-performance computing
Problems Solved: - Efficient heat dissipation - Temperature regulation in electronic devices - Improved thermal performance
Benefits: - Enhanced cooling efficiency - Increased device reliability - Extended lifespan of electronic components
Commercial Applications: Title: Advanced Thermal Management Solutions for Communication Devices This technology can be utilized in smartphones, laptops, servers, and other communication devices to improve thermal performance, enhance reliability, and prolong the lifespan of electronic components.
Questions about Phase Change Heatsink Technology: 1. How does the phase change heatsink technology improve thermal management in communication devices? 2. What are the key advantages of using a phase change heatsink in electronic devices?
Frequently Updated Research: Researchers are continuously exploring new materials and designs to further enhance the efficiency and effectiveness of phase change heatsinks in various applications. Stay updated on the latest advancements in thermal management technologies for electronic devices.
Original Abstract Submitted
A phase change heatsink, a process for manufacturing the heatsink, and a communication device having the heatsink are disclosed. The phase change heatsink includes a heatsink base and a phase change heat spreader integrated into the heatsink base. The phase change heat spreader includes a cover attached to the heatsink base and defines an enclosed cavity, in which one or more support pillars are provided in the enclosed cavity to extend from the heatsink base to the cover, and which is partially filled with refrigerant. The process comprises steps of: a) die-casting the heatsink base to shape the cavity and the support pillars; b) attaching the cover to the heatsink base to enclose the cavity; and c) filling a certain amount of refrigerant into the cavity through a filling port, and scaling the filling port. The attaching step b) further comprises a step b1) of sealing a periphery of the cover to the heatsink base, and a step b2) of bonding a central portion of the cover to the support pillars.
