18676114. SEMICONDUCTOR DEVICE, INSPECTION APPARATUS OF SEMICONDUCTOR DEVICE, AND METHOD FOR INSPECTING SEMICONDUCTOR DEVICE simplified abstract (KABUSHIKI KAISHA TOSHIBA)
SEMICONDUCTOR DEVICE, INSPECTION APPARATUS OF SEMICONDUCTOR DEVICE, AND METHOD FOR INSPECTING SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Yosuke Kajiwara of Yokohama (JP)
Masahiko Kuraguchi of Yokohama (JP)
SEMICONDUCTOR DEVICE, INSPECTION APPARATUS OF SEMICONDUCTOR DEVICE, AND METHOD FOR INSPECTING SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18676114 titled 'SEMICONDUCTOR DEVICE, INSPECTION APPARATUS OF SEMICONDUCTOR DEVICE, AND METHOD FOR INSPECTING SEMICONDUCTOR DEVICE
The semiconductor device described in the abstract includes a first transistor with a nitride semiconductor layer and three element electrodes, as well as a first mounting member with various connection elements.
- The semiconductor device features a first transistor with a nitride semiconductor layer and three element electrodes.
- The first mounting member includes a first frame electrode, frame connection members, a pad electrode, and a pad connection member.
- The connection elements in the mounting member facilitate electrical connections between the transistor electrodes and the frame and pad electrodes.
Potential Applications: - This technology could be used in various electronic devices requiring high-performance transistors. - It may find applications in power electronics, telecommunications, and computing.
Problems Solved: - Provides a reliable and efficient way to mount and connect semiconductor devices. - Enhances the performance and stability of the transistor by ensuring proper electrical connections.
Benefits: - Improved reliability and performance of semiconductor devices. - Simplified manufacturing processes for electronic components.
Commercial Applications: Title: Advanced Semiconductor Device for High-Performance Electronics This technology could be valuable in the production of advanced electronic devices, leading to improved performance and reliability in various industries such as telecommunications, computing, and power electronics.
Questions about the technology: 1. How does the nitride semiconductor layer in the first transistor contribute to its performance? 2. What are the advantages of using a mounting member with multiple connection elements in semiconductor devices?
Original Abstract Submitted
According to one embodiment, a semiconductor device includes a first transistor, and a first mounting member. The first transistor includes a nitride semiconductor layer and includes a first element electrode, a second element electrode, and a third element electrode. The first mounting member includes a first frame electrode, a plurality of first frame connection members electrically connecting the first element electrode and the first frame electrode, a first pad electrode, and a first pad connection member electrically connecting the first element electrode and the first pad electrode.
