18674950. SEMICONDUCTOR DEVICE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.)
Contents
SEMICONDUCTOR DEVICE
Organization Name
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
Inventor(s)
MING-HO Tsai of HSINCHU CITY (TW)
JYUN-HONG Chen of TAICHUNG CITY (TW)
CHUN-CHEN Liu of KAOHSIUNG CITY (TW)
PENG-REN Chen of HSINCHU CITY (TW)
WEN-HAO Cheng of HSINCHU CITY (TW)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18674950 titled 'SEMICONDUCTOR DEVICE
The semiconductor device described in the abstract includes two formation sites for conductive bumps, with the size of the second site adjusting based on environmental density.
- The cross-sectional area of the second formation site increases when the environmental density is higher than the first site.
- Environmental density is determined by the number of formation sites around each site within a set range.
- The layout of the first area with higher density forms an ellipse, while the second area with lower density forms a strip layout around the ellipse.
Potential Applications: - This technology could be used in semiconductor manufacturing processes to optimize the formation of conductive bumps. - It may improve the efficiency and reliability of semiconductor devices by adjusting the size of formation sites based on environmental density.
Problems Solved: - Addresses the challenge of optimizing the formation of conductive bumps in semiconductor devices. - Provides a solution to adjust the size of formation sites based on environmental density for improved performance.
Benefits: - Enhanced efficiency in semiconductor manufacturing processes. - Improved reliability and performance of semiconductor devices. - Potential cost savings through optimized formation site sizes.
Commercial Applications: Title: Semiconductor Device Optimization Technology for Enhanced Performance This technology could be utilized by semiconductor manufacturers to improve the quality and efficiency of their products, leading to better performance and reliability in various electronic devices. The market implications include increased competitiveness and customer satisfaction in the semiconductor industry.
Questions about Semiconductor Device Optimization Technology: 1. How does the adjustment of formation site sizes based on environmental density impact the overall performance of semiconductor devices? - The adjustment helps optimize the formation of conductive bumps, leading to improved efficiency and reliability in semiconductor devices.
2. What are the potential cost savings associated with using this technology in semiconductor manufacturing processes? - By optimizing formation site sizes, manufacturers can potentially reduce material waste and improve production efficiency, resulting in cost savings.
Original Abstract Submitted
A semiconductor device including: a first formation site and a second formation site for forming a first conductive bump and a second conductive bump; when a first environmental density corresponding to the first formation site is greater than a second environmental density corresponding to the second formation site, a cross sectional area of the second formation site is greater than a cross sectional area of the first formation site; wherein the first environmental density is determined by a number of formation sites around the first formation site in a predetermined range and the second environmental density is determined by a number of formation sites around the second formation site in the predetermined range; wherein a first area having the first environmental density forms an ellipse layout while a second area having the second environmental density forms a strip layout surrounding the ellipse layout.
