18666091. ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREOF, AND ELECTRONIC APPARATUS simplified abstract (CANON KABUSHIKI KAISHA)
Contents
ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREOF, AND ELECTRONIC APPARATUS
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ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREOF, AND ELECTRONIC APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18666091 titled 'ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREOF, AND ELECTRONIC APPARATUS
The abstract describes a manufacturing method for an electronic component involving the bonding of two structures with electrodes via a curing process using light irradiation through a window portion.
- First structure with a first electrode on a substrate
- Second structure with a second electrode on another substrate
- Curing a bonding member between the two structures
- Applying force to pressurize the bonding member
- At least one electrode includes a window portion
- Curing process involves light irradiation through the window portion
Potential Applications: - Manufacturing of electronic components - Semiconductor industry - Microelectronics
Problems Solved: - Efficient bonding of electronic components - Precise alignment of electrodes - Enhanced durability of the bonding member
Benefits: - Improved reliability of electronic components - Cost-effective manufacturing process - Increased productivity in production
Commercial Applications: - Production of integrated circuits - Assembly of sensors and actuators - Manufacturing of electronic devices
Prior Art: Prior research may include methods for bonding electronic components using different curing techniques and materials.
Frequently Updated Research: Ongoing research may focus on optimizing the curing process for enhanced bonding strength and efficiency.
Questions about the Manufacturing Method of an Electronic Component: 1. How does the curing process using light irradiation through a window portion improve the bonding of electronic components? 2. What are the potential challenges in implementing this manufacturing method on a large scale?
Original Abstract Submitted
A manufacturing method of an electronic component includes preparing a first structure in which a first electrode is arranged on a first main surface of a first substrate, preparing a second structure in which a second electrode is arranged on a first main surface of a second substrate, and curing a bonding member while making the first main surface of the first substrate and the first main surface of the second substrate face each other via the bonding member and applying a force to the first structure and the second structure so as to pressurize the bonding member. At least one of the first electrode and the second electrode includes a window portion. In the curing, the bonding member is cured by irradiating the bonding member with light through the window portion.
