18662586. PACKAGE STRUCTURE WITH A BARRIER LAYER simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

PACKAGE STRUCTURE WITH A BARRIER LAYER

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor(s)

Cheng-Hung Chen of Tainan City (TW)

Yu-Nu Hsu of Tainan (TW)

Chun-Chen Liu of Kaohsiung City (TW)

Heng-Chi Huang of Zhudong Township (TW)

Chien-Chen Li of Hsinchu (TW)

Shih-Yen Chen of Hsinchu City (TW)

Cheng-Nan Hsieh of Chubei City (TW)

Kuo-Chio Liu of Hsinchu City (TW)

Chen-Shien Chen of Zhubei City (TW)

Chin-Yu Ku of Hsinchu City (TW)

Te-Hsun Pang of Tainan City (TW)

Yuan-Feng Wu of Tainan City (TW)

Sen-Chi Chiang of Tainan City (TW)

PACKAGE STRUCTURE WITH A BARRIER LAYER - A simplified explanation of the abstract

This abstract first appeared for US patent application 18662586 titled 'PACKAGE STRUCTURE WITH A BARRIER LAYER

The package structure described in the patent application includes multiple layers and components such as substrates, through vias, redistribution layers, pillar layers, barrier layers, cap layers, and underfill layers.

• The package structure consists of a first substrate with through vias, redistribution layers, a pillar layer, a barrier layer, a cap layer, and an underfill layer.
• The first barrier layer has a protruding portion extending outside the sidewall surfaces of the first pillar layer and the first cap layer.
• The package structure is designed to provide enhanced performance and reliability in electronic packaging applications.
• The innovative design of the package structure aims to improve signal integrity and thermal management in electronic devices.
• The combination of different layers and components in the package structure offers a comprehensive solution for advanced packaging needs in the semiconductor industry.

Potential Applications: The technology described in the patent application can be applied in various electronic devices such as smartphones, tablets, laptops, and other consumer electronics. The package structure can also be used in automotive electronics, medical devices, and industrial equipment where high-performance packaging is required.

Problems Solved: The package structure addresses challenges related to signal integrity, thermal management, and reliability in electronic packaging. By incorporating multiple layers and components, the technology offers a holistic solution to packaging issues in advanced electronic devices.

Benefits: Enhanced performance and reliability in electronic packaging applications. Improved signal integrity and thermal management. Comprehensive solution for advanced packaging needs in the semiconductor industry.

Commercial Applications: The technology can be utilized by semiconductor manufacturers, electronic device manufacturers, and other industries requiring high-performance packaging solutions. The innovative package structure can help companies improve the quality and durability of their electronic products, leading to increased customer satisfaction and market competitiveness.

Prior Art: Prior art related to package structures and methods for electronic packaging can be found in research papers, patents, and industry publications. Researchers and engineers in the field of electronic packaging have explored various techniques and materials to improve the performance and reliability of electronic devices.

Frequently Updated Research: Researchers are continuously exploring new materials, designs, and manufacturing processes to further enhance the performance and reliability of package structures in electronic devices. Advancements in nanotechnology, materials science, and semiconductor manufacturing are driving innovation in electronic packaging technologies.

Questions about Package Structures: 1. What are the key components of the package structure described in the patent application? The key components of the package structure include substrates, through vias, redistribution layers, pillar layers, barrier layers, cap layers, and underfill layers.

2. How does the package structure address challenges related to signal integrity and thermal management in electronic devices? The package structure is designed to improve signal integrity and thermal management by incorporating multiple layers and components that enhance performance and reliability in electronic packaging applications.

Original Abstract Submitted

Package structures and methods for manufacturing the same are provided. The package structure includes a first substrate and through vias formed through the first substrate. The package further includes redistribution layers formed over the first substrate and connected to the through vias and a first pillar layer formed over the redistribution layers. The package further includes a first barrier layer formed over the first pillar layer and a first cap layer formed over the first barrier layer. The package further includes an underfill layer formed over the redistribution layers and surrounding the first pillar layer, the first barrier layer, and the first cap layer. In addition, the first barrier layer has a first protruding portion laterally extending outside a first sidewall surface of the first pillar layer and a second sidewall surface of the first cap layer.