18662075. PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor(s)

Po-Chen Lai of Hsinchu County (TW)

Ming-Chih Yew of Hsinchu City (TW)

Li-Ling Liao of Hsinchu City (TW)

Chin-Hua Wang of New Taipei City (TW)

Po-Yao Lin of Zhudong Township (TW)

Shin-Puu Jeng of Po-Shan Village (TW)

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18662075 titled 'PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

The abstract of the patent application describes a package structure consisting of a package component over a redistribution structure, a substrate under the redistribution structure, and an underfill material over the redistribution structure with a first extending portion.

• The package component has a first sidewall and a second sidewall connected at a corner.
• The first extending portion in the structure passes through the package component's sidewalls.
• In a plan view, the first extending portion has a first sidewall passing through the package component's first sidewall and a second sidewall passing through the package component's second sidewall.

Potential Applications: - This package structure could be used in electronic devices such as smartphones, tablets, and laptops. - It could also be applied in automotive electronics and medical devices.

Problems Solved: - Provides structural integrity and protection to delicate electronic components. - Enhances the reliability and longevity of electronic devices.

Benefits: - Improved durability and robustness of electronic packages. - Enhanced performance and functionality of electronic devices.

Commercial Applications: Title: Advanced Package Structure for Electronic Devices This technology can be utilized in the consumer electronics industry to improve the quality and reliability of electronic devices, leading to increased customer satisfaction and brand loyalty. It can also be adopted in the automotive and medical device sectors to enhance the performance and longevity of electronic components in these applications.

Questions about the technology: 1. How does the package structure improve the reliability of electronic devices? - The package structure provides structural integrity and protection to delicate electronic components, reducing the risk of damage and failure.

2. What are the potential applications of this package structure beyond consumer electronics? - This package structure can also be applied in automotive electronics and medical devices to enhance the performance and reliability of electronic components in these industries.

Original Abstract Submitted

A package structure is provided. The package structure includes a package component over a redistribution structure, a substrate under the redistribution structure, and an underfill material over the redistribution structure and including a first extending portion in the structure. The package component has a first sidewall and a second sidewall connected to the first sidewall at a first corner. In a plan view, the first extending portion has a first sidewall passing through the first sidewall of the package component and a second sidewall opposite to the first sidewall of the first extending portion and passing through the second sidewall of the package component.