18654268. Structure and Method of Forming a Joint Assembly simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Contents
Structure and Method of Forming a Joint Assembly
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Ying-Ju Chen of Tuku Township (TW)
An-Jhih Su of Taoyuan City (TW)
Hsien-Wei Chen of Hsinchu (TW)
Der-Chyang Yeh of Hsinchu (TW)
Structure and Method of Forming a Joint Assembly - A simplified explanation of the abstract
This abstract first appeared for US patent application 18654268 titled 'Structure and Method of Forming a Joint Assembly
The abstract describes a method of manufacturing a semiconductor device structure by forming a bond between a first device with an integrated passive device (IPD) and a first contact pad, and a second device with a second contact pad. A solder layer is interposed between the contact pads with tapered sidewalls.
- The method involves forming a bond between two devices with different contact pad widths.
- The solder layer has tapered sidewalls for a secure joint structure.
- At least one of the contact pad surfaces is substantially planar.
- The first device includes an IPD, enhancing the functionality of the semiconductor device.
- The joint structure ensures a reliable connection between the two devices.
Potential Applications: This technology can be used in the manufacturing of various semiconductor devices, such as integrated circuits, sensors, and communication devices.
Problems Solved: This method addresses the challenge of forming a reliable bond between devices with different contact pad widths, ensuring a secure connection.
Benefits: The method provides a stable joint structure, enhancing the performance and reliability of semiconductor devices. It also allows for the integration of passive devices into the semiconductor structure.
Commercial Applications: This technology can be applied in the production of advanced electronic devices, leading to improved functionality and durability in various industries such as telecommunications, automotive, and consumer electronics.
Prior Art: Researchers can explore prior studies on semiconductor device bonding techniques and joint structures to understand the evolution of this technology.
Frequently Updated Research: Researchers are continually exploring new materials and techniques to further enhance the bond strength and reliability of semiconductor device structures.
Questions about Semiconductor Device Bonding: 1. How does the tapered sidewall design of the solder layer contribute to the reliability of the joint structure? 2. What are the potential challenges in scaling up this manufacturing method for mass production?
Original Abstract Submitted
A method of manufacturing a semiconductor device structure includes forming a bond or joint between a first device and a second device. The first device comprises an integrated passive device (IPD) and a first contact pad disposed over the IPD. The second device comprises a second contact pad. The first contact pad has a first surface with first lateral extents. The second contact pad has a second surface with second lateral extents. The width of the second lateral extents is less than the width of the first lateral extents. The joint structure includes the first contact pad, the second contact pad, and a solder layer interposed therebetween. The solder layer has tapered sidewalls extending in a direction away from the first surface of the first contact pad to the second surface of the second contact pad. At least one of the first surface or the second surface is substantially planar.
