18652836. SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
Contents
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18652836 titled 'SEMICONDUCTOR DEVICE
The semiconductor device described in the abstract includes a chip with a main surface, a main surface electrode, a terminal electrode, and a sealing insulator.
- The main surface electrode is arranged on the main surface of the chip.
- The terminal electrode is arranged on the main surface electrode, exposing a part of it.
- The sealing insulator covers the periphery of the terminal electrode, exposing a part of it, and directly covers a portion of the main surface electrode.
Potential Applications:
- This technology can be used in various semiconductor devices such as integrated circuits, sensors, and transistors.
- It can also be applied in electronic components for consumer electronics, automotive systems, and industrial machinery.
Problems Solved:
- Provides protection and insulation for the terminal electrode while allowing for electrical connections.
- Ensures the reliability and longevity of the semiconductor device by preventing external contaminants from affecting its performance.
Benefits:
- Enhances the durability and stability of semiconductor devices.
- Facilitates efficient electrical connections and signal transmission.
- Improves the overall performance and reliability of electronic systems.
Commercial Applications:
- This technology has significant commercial potential in the semiconductor industry, electronics manufacturing, and technology sectors.
- It can be integrated into a wide range of electronic devices to enhance their functionality and performance.
Questions about the technology: 1. How does the sealing insulator contribute to the overall reliability of the semiconductor device? 2. What are the specific advantages of having a terminal electrode exposed on the main surface electrode?
Original Abstract Submitted
A semiconductor device includes a chip that has a main surface, a main surface electrode that is arranged on the main surface, a terminal electrode that is arranged on the main surface electrode such as to expose a part of the main surface electrode; and a sealing insulator that covers a periphery of the terminal electrode such as to expose a part of the terminal electrode, and that has a portion directly covering the main surface electrode.
