18652832. SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)

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SEMICONDUCTOR DEVICE

Organization Name

ROHM CO., LTD.

Inventor(s)

Yuki Nakano of Kyoto-shi (JP)

SEMICONDUCTOR DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18652832 titled 'SEMICONDUCTOR DEVICE

Simplified Explanation:

This semiconductor device includes a chip with a main surface, pillar electrodes arranged on the main surface electrode, a sealing insulator covering the region between the pillar electrodes, and terminal films covering the pillar electrodes.

Key Features and Innovation:

  • Chip with main surface and pillar electrodes
  • Sealing insulator covering region between pillar electrodes
  • Terminal films covering pillar electrodes

Potential Applications: This technology could be used in various semiconductor devices, such as integrated circuits, sensors, and memory devices.

Problems Solved: This technology addresses the need for efficient and reliable semiconductor devices with improved performance and durability.

Benefits: The benefits of this technology include enhanced functionality, increased reliability, and improved overall performance of semiconductor devices.

Commercial Applications: This technology has potential commercial applications in the electronics industry, specifically in the manufacturing of advanced semiconductor devices for various electronic products.

Prior Art: Readers interested in prior art related to this technology could start by researching semiconductor device patents and innovations in the field of electronic components.

Frequently Updated Research: Researchers are continually exploring new materials and designs to further improve the performance and efficiency of semiconductor devices.

Questions about Semiconductor Devices: 1. What are the key components of a semiconductor device and how do they function together? 2. How does the design of pillar electrodes contribute to the overall performance of a semiconductor device?


Original Abstract Submitted

A semiconductor device includes a chip that has a main surface, a main surface electrode that covers the main surface, pillar electrodes that are arranged on the main surface electrode at an interval, a sealing insulator that covers a region between the pillar electrodes on the main surface electrode such as to expose parts of the pillar electrodes, and at least one terminal film that covers at least one of the pillar electrodes on the sealing insulator.