18652365. SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
Contents
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Yo Mochizuki of Kyoto-shi (JP)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18652365 titled 'SEMICONDUCTOR DEVICE
The semiconductor device described in the abstract includes a conductive member, a semiconductor element, and a sealing resin. The conductive member has an obverse surface and a reverse surface facing away from each other in a thickness direction. The semiconductor element is bonded to the obverse surface, and the sealing resin covers both the conductive member and the semiconductor element. The obverse surface is surrounded by the reverse surface when viewed in the thickness direction, and the conductive member includes a first end surface that is inclined relative to the reverse surface and overlaps with it in the thickness direction.
- The semiconductor device features a conductive member with obverse and reverse surfaces, a semiconductor element bonded to the obverse surface, and a sealing resin covering both components.
- The conductive member's first end surface is inclined relative to the reverse surface and overlaps with it in the thickness direction.
- The design ensures proper protection and encapsulation of the semiconductor element within the device.
- The unique configuration of the conductive member enhances the overall performance and durability of the semiconductor device.
- This innovation offers improved reliability and functionality in semiconductor applications.
Potential Applications: This technology can be applied in various semiconductor devices, such as integrated circuits, sensors, and power modules.
Problems Solved: The semiconductor device addresses issues related to protection, bonding, and encapsulation of semiconductor elements in electronic applications.
Benefits: Enhanced reliability, improved performance, and increased durability in semiconductor devices.
Commercial Applications: This technology can be utilized in the manufacturing of consumer electronics, automotive electronics, and industrial equipment.
Questions about Semiconductor Devices: 1. How does the design of the conductive member contribute to the overall performance of the semiconductor device? 2. What are the potential market implications of implementing this technology in various electronic applications?
Frequently Updated Research: Researchers are continuously exploring new materials and techniques to further enhance the efficiency and reliability of semiconductor devices.
Original Abstract Submitted
A semiconductor device includes a conductive member, a semiconductor element, and a sealing resin. The conductive member includes an obverse surface and a reverse surface facing away from each other in a thickness direction. The semiconductor element is bonded to the obverse surface. The sealing resin covers the conductive member and the semiconductor element. As viewed in the thickness direction, the obverse surface is surrounded by the reverse surface. The conductive member includes a first end surface located between the obverse surface and the reverse surface in the thickness direction. The first end surface is inclined relative to the reverse surface. The first end surface overlaps with the reverse surface as viewed in the thickness direction.
