18651849. Resonator Device simplified abstract (SEIKO EPSON CORPORATION)
Contents
Resonator Device
Organization Name
Inventor(s)
Junichi Takeuchi of Chino (JP)
Tomoyuki Kamakura of Matsumoto (JP)
Ryuta Nishizawa of Nagano (JP)
Yukihiro Hashi of Shiojiri (JP)
Resonator Device - A simplified explanation of the abstract
This abstract first appeared for US patent application 18651849 titled 'Resonator Device
The resonator device described in the patent application consists of a base, a resonator element with a resonator substrate and an electrode, a conductive layer on the base, a metal bump between the conductive layer and the resonator element for electrical coupling, and low elastic modulus layers between the base and the conductive layer, and the resonator substrate and the electrode.
- The device includes a base, resonator element, conductive layer, metal bump, and low elastic modulus layers.
- The metal bump electrically couples the conductive layer and the electrode while bonding them together.
- The low elastic modulus layers have a smaller elastic modulus than the metal bump.
- The low elastic modulus layers overlap the metal bump in a plan view of the base.
- The device aims to improve the performance and reliability of resonator devices.
Potential Applications: This technology can be applied in various electronic devices such as sensors, filters, and communication systems where resonator devices are used.
Problems Solved: The technology addresses issues related to the electrical coupling and bonding of components in resonator devices, improving their overall performance and reliability.
Benefits: Enhanced performance, improved reliability, and increased efficiency of resonator devices.
Commercial Applications: This technology can be utilized in the telecommunications industry for the development of high-performance communication systems, in the automotive sector for sensor applications, and in the consumer electronics market for improved filter systems.
Questions about Resonator Devices: 1. How does the metal bump improve the electrical coupling in the resonator device? 2. What are the specific advantages of using low elastic modulus layers in this technology?
Frequently Updated Research: Researchers are continually exploring new materials and designs to further enhance the performance of resonator devices. Stay updated on the latest advancements in the field for potential improvements in this technology.
Original Abstract Submitted
A resonator device includes: a base; a resonator element that includes a resonator substrate and an electrode; a conductive layer that is disposed on the base; a metal bump that is disposed between the conductive layer and the resonator element, and that electrically couples the conductive layer and the electrode while bonding the conductive layer and the resonator element; and at least one of a first low elastic modulus layer that is interposed between the base and the conductive layer, that overlaps the metal bump in a plan view of the base, and that has an elastic modulus smaller than that of the metal bump, and a second low elastic modulus layer that is interposed between the resonator substrate and the electrode, that overlaps the metal bump in the plan view of the base, and that has an elastic modulus smaller than that of the metal bump.
